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    Conductive substrate with resistance layer, resistance board, and resistance circuit board
    1.
    发明授权
    Conductive substrate with resistance layer, resistance board, and resistance circuit board 失效
    具有电阻层，电阻板和电阻电路板的导电基板

    公开(公告)号：US07215235B2

    公开(公告)日：2007-05-08

    申请号：US10819929

    申请日：2004-04-08

    申请人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

    发明人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

    IPC分类号： H01C1/012

    CPC分类号： H01C17/065 ,  H05K1/167 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723

    摘要： A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

    摘要翻译： 一种具有电阻层的导电性基板，其特征在于，具有通过电阻部件在其表面上被电阻成分处理的基本平坦的高导电性基板粗糙化，并且通过所述电阻部件设置有电阻层，使得能够使高导电性基板和电阻成分层之间的界面成为 基本平坦化，能够在剥离高导电性基材后能够获得具有稳定电阻的薄膜电阻层，并且能够与绝缘支撑体一起保持剥离强度，以及使用其的电阻板。

    CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF PRODUCTION OF CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, AND CIRCUIT BOARD WITH THIN FILM RESISTANCE LAYER
    4.
    发明申请
    CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF PRODUCTION OF CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, AND CIRCUIT BOARD WITH THIN FILM RESISTANCE LAYER 审中-公开
    具有薄膜电阻层的导电基材，具有薄膜电阻层的导电基材的生产方法和具有薄膜电阻层的电路板

    公开(公告)号：US20070228443A1

    公开(公告)日：2007-10-04

    申请号：US11693273

    申请日：2007-03-29

    申请人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

    发明人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

    IPC分类号： H05K1/03

    CPC分类号： H05K1/167 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T29/49082

    摘要： An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.

    摘要翻译： 具有薄膜电阻层的廉价的导电基材，具有薄的电阻值变化小的导电性基材和具有通过稳定地留下电阻元件而制造印刷电阻电路板的电阻层的导电性基材，即导电性基材 具有薄膜电阻层，其由在其表面上形成有电阻层的导电性基材构成，其中电阻层包括含有P的Ni和非晶态和晶体形式混合在一起，并且具有薄膜电阻层的导电基材包含 具有在其表面上形成的电阻层的导电基材，其中电阻层是包含含Ni的结晶薄膜电阻层。

    Surface treated electrodeposited copper foil, the production method and circuit board
    5.
    发明申请
    Surface treated electrodeposited copper foil, the production method and circuit board 失效
    表面处理电沉积铜箔，生产方法和电路板

    公开(公告)号：US20070287020A1

    公开(公告)日：2007-12-13

    申请号：US11808049

    申请日：2007-06-06

    申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

    发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

    IPC分类号： C22C9/00

    CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

    摘要： To provide a surface treated electrodeposited copper foil having a smooth M surface with less asperity on the surface instead of an S surface affected by stripes transferred from a surface drum; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC (total organic carbon) is 400 ppm or smaller, and a current density is 20 to 50 A/dm2, and a surface treatment is performed on an M surface of the copper foil to attain Rz of 1.0 μm or smaller and Ra of 0.2 μm or smaller on the M surface.

    摘要翻译： 提供具有光滑M表面的表面处理电沉积铜箔，而不是表面受到从表面转鼓传送的条纹影响的S表面; 在M表面上进行表面处理，M表面是与电沉积铜箔中的滚筒接触的表面的相对表面，其中Rz为1.0μm或更小，并且Ra为0.2μm或更小，电沉积铜镀层为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC（总有机碳）为400ppm以下， 电流密度为20〜50A / dm 2，对铜箔的M面进行表面处理，使M表面的Rz为1.0μm以下，Ra为0.2μm以下。

    Surface treated electrodeposited copper foil and circuit board
    6.
    发明授权
    Surface treated electrodeposited copper foil and circuit board 失效
    表面处理电沉积铜箔和电路板

    公开(公告)号：US08153273B2

    公开(公告)日：2012-04-10

    申请号：US11808049

    申请日：2007-06-06

    申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

    发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

    IPC分类号： B32B15/04 ,  B32B15/20

    CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

    摘要： A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.

    摘要翻译： 具有光滑M表面的经表面处理的电沉积铜箔; 在M表面上进行表面处理，M表面是与电沉积铜箔中的鼓接触的表面的相对表面，其中Rz为1.0μm以下，Ra为50μm以下，电镀铜为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC为400ppm以下，电流密度为20〜 50 A / dm2。

    Coin processor for use with automatic vending machines
    8.
    发明授权
    Coin processor for use with automatic vending machines 失效
    用于自动售货机的硬币处理器

    公开(公告)号：US5380242A

    公开(公告)日：1995-01-10

    申请号：US21458

    申请日：1993-02-23

    申请人： Sadao Matsumoto ,  Hiroaki Mannen

    发明人： Sadao Matsumoto ,  Hiroaki Mannen

    IPC分类号： G07D1/00 ,  G07F5/24 ,  G07D3/16

    CPC分类号： G07F5/24

    摘要： A coin processor is described in which coins deposited in a vending machine classified according to value in coin storage cylinders and wherein a coin recovery system includes a controller for controlling the discharge mechanisms operative with the respective coin storage cylinders to enable, when desired, the recovery of coins from the storage cylinder according to a predetermined sequence by actuation of a prescribed switch or, alternatively, recovery of coins from any particular storage cylinder by actuation of a switch associated therewith. The controller is capable of overriding the sequenced discharge of coins from the respective cylinders upon subsequent actuation of a required switch. The described processor employs a preset counter and a change detection sensor associated with each respective coin storage cylinder for terminating the coin discharge operation from each respective storage cylinder upon the discharge of a predetermined counted number of coins.

    摘要翻译： 描述了一种硬币处理器，其中根据硬币存储缸中的价值分类的自动售货机中存储的硬币，并且其中硬币回收系统包括用于控制与各个硬币存储缸一起操作的排出机构的控制器，以便在需要时能够恢复 通过致动规定的开关按照预定顺序从存储筒中的硬币，或者通过致动与其相关联的开关来从任何特定的储存圆筒回收硬币。 控制器能够在随后激活所需开关时从相应的气缸重新排列硬币排序。 所描述的处理器采用与每个相应的硬币储存筒相关联的预设计数器和变化检测传感器，用于在排出预定数量的硬币时终止来自每个相应存储缸的硬币排出操作。

    Indirectly heated cathode assembly and its associated electron gun structure
    10.
    发明授权
    Indirectly heated cathode assembly and its associated electron gun structure 失效
    间接加热的阴极组件及其相关的电子枪结构

    公开(公告)号：US5027029A

    公开(公告)日：1991-06-25

    申请号：US447904

    申请日：1989-12-08

    申请人： Toshiharu Higuchi ,  Sadao Matsumoto ,  Toru Yakabe ,  Sakae Kimura

    发明人： Toshiharu Higuchi ,  Sadao Matsumoto ,  Toru Yakabe ,  Sakae Kimura

    IPC分类号： H01J1/20 ,  H01J1/28 ,  H01J29/04

    CPC分类号： H01J29/04 ,  H01J1/20

    摘要： An indirectly heated type cathode assembly comprises a cathode sleeve having a heater within itself and having an emitter-impregnated type cathode disc fitted at one end, a plurality of straps connected at one end to a lower end portion of the cathode sleeve, and a cylinder holder whose upper end is connected to the other end of each strap, the holder being located outside the cathode sleeve such that it is spaced a predetermined distance apart from the cathode sleeve. A heat reflecting cylinder is located between the cathode sleeve and the holder of the indirectly heated type cathode assembly such that it is coaxial with the cathode sleeve and holder. The heat reflecting cylinder is supported by the holder and each strap extends such that it is not in contact with the heat reflecting cylinder. The strap is made of a Ta-W alloy or a Ta-W-Hf alloy. An electron gun structure comprises the indirectly heated type cathode assembly, a first grid placed in front of the indirectly heated type cathode assembly and an insulation support into which the first grid and the holder of the indirectly heated type cathode assembly are embedded partially and directly through a securing piece, respectively. The cathode disc is hidden, by a heat reflecting cylinder, from view at least that portion of the insulating support which is defined between an embedded spot of the first grid and that of the securing piece.