Invention Application
US20050280503A1 Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unit
审中-公开
具有识别单元的半导体晶片和使用识别单元识别半导体晶片的方法
- Patent Title: Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unit
- Patent Title (中): 具有识别单元的半导体晶片和使用识别单元识别半导体晶片的方法
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Application No.: US11147314Application Date: 2005-06-08
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Publication No.: US20050280503A1Publication Date: 2005-12-22
- Inventor: Sang-Woo Lee , Cheol-Joon Yoo , Dong-Bin Kim
- Applicant: Sang-Woo Lee , Cheol-Joon Yoo , Dong-Bin Kim
- Priority: KR2004-44495 20040616
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L23/544 ; H04Q5/22
Abstract:
A semiconductor wafer, comprising a radio frequency identification (RFID) chip on one side of the semiconductor wafer, on which a pattern has been formed, wherein information on the wafer is input to and/or output from the RFID chip using radio frequency communication.
Information query
IPC分类:
