发明申请
- 专利标题: Electronic component cooling apparatus
- 专利标题(中): 电子部件冷却装置
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申请号: US11211856申请日: 2005-08-25
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公开(公告)号: US20050280995A1公开(公告)日: 2005-12-22
- 发明人: Masayuki Iijima , Masashi Miyazawa , Kouji Ueno
- 申请人: Masayuki Iijima , Masashi Miyazawa , Kouji Ueno
- 申请人地址: JP Tokyo
- 专利权人: SANYO DENKI CO., LTD.
- 当前专利权人: SANYO DENKI CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2003-097393 20030331
- 主分类号: F01P3/12
- IPC分类号: F01P3/12 ; F01P5/02 ; F01P5/04 ; F28D1/053 ; H01L23/473 ; H02K7/14 ; H02K21/22 ; H05K7/20
摘要:
An electronic component cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for giving a moving energy to the coolant. A plurality of engaging pieces of the motor-driven fan and a plurality of engaged portion of the radiator are engaged to connect the motor-driven fan and the radiator.