发明申请
- 专利标题： STRUCTURE AND METHOD FOR COLLAR SELF-ALIGNED TO BURIED PLATE
- 专利标题（中）： 用于自对准到板坯的结构和方法
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申请号： US10710061申请日： 2004-06-16
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公开(公告)号： US20050282393A1公开(公告)日： 2005-12-22
- 发明人: Kangguo Cheng , Ramachandra Divakaruni , Carl Radens
- 申请人： Kangguo Cheng , Ramachandra Divakaruni , Carl Radens
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/308 ; H01L21/8242
摘要：
A structure and method are provided for forming a collar surrounding a portion of a trench in a semiconductor substrate, the collar having a lower edge self-aligned to a top edge of a buried plate disposed adjacent to a lower portion of the trench.