发明申请
- 专利标题： Conductive polishing article for electrochemical mechanical polishing
- 专利标题（中）： 电化学机械抛光用导电抛光制品
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申请号： US11215254申请日： 2005-08-30
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公开(公告)号： US20050284770A1公开(公告)日： 2005-12-29
- 发明人: Paul Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
- 申请人： Paul Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： B23H5/00
- IPC分类号： B23H5/00 ; B23H5/06 ; B23H5/08 ; B23H5/10 ; B24B37/04 ; B24B49/16 ; B24B53/007 ; B24D13/14 ; C25D17/00 ; C25D17/10 ; H01L21/321
摘要：
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
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