发明申请
US20060000808A1 Polishing solution of metal and chemical mechanical polishing method
审中-公开
金属抛光液和化学机械抛光方法
- 专利标题： Polishing solution of metal and chemical mechanical polishing method
- 专利标题（中）： 金属抛光液和化学机械抛光方法
-
申请号： US11169577申请日： 2005-06-30
-
公开(公告)号： US20060000808A1公开(公告)日： 2006-01-05
- 发明人: Hiroyuki Seki , Naoki Asanuma , Takatoshi Ishikawa , Katsuhiro Yamashita , Tomohiko Akatsuka
- 申请人： Hiroyuki Seki , Naoki Asanuma , Takatoshi Ishikawa , Katsuhiro Yamashita , Tomohiko Akatsuka
- 专利权人： FUJI PHOTO FILM CO., LTD.
- 当前专利权人： FUJI PHOTO FILM CO., LTD.
- 优先权： JPP.2004-195730 20040701; JPP.2004-279491 20040927; JPP.2004-279703 20040927
- 主分类号： B44C1/22
- IPC分类号： B44C1/22 ; C09K13/00
摘要：
A polishing solution for metal comprises a specific compound represented and an oxidizing agent. A chemical mechanical polishing method for a semiconductor substrate, comprises: supplying a polishing solution for metal comprising a specific compound; and an oxidizing agent; allowing a polishing face and a face to be polished to be moved relatively to each other while the polishing face and the face to be polished are in contact with each other via the polishing solution for metal; and performing polishing with a contact pressure between the polishing face and the face to be polished in the range of from 1000 to 25000 Pa.
信息查询
