Invention Application
- Patent Title: Interconnect structure in integrated circuits
- Patent Title (中): 集成电路中的互连结构
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Application No.: US10880988Application Date: 2004-06-30
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Publication No.: US20060001103A1Publication Date: 2006-01-05
- Inventor: Maged Ghoneima , Muhammad Khellah , James Tschanz , Yibin Ye , Vivek De
- Applicant: Maged Ghoneima , Muhammad Khellah , James Tschanz , Yibin Ye , Vivek De
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/8238
Abstract:
A device includes an interconnect structure having a number of circuit paths to transfer signals. The circuit paths transfer the signals at different speed to reduce the coupling capacitance effect between adjacent circuit paths.
Public/Granted literature
- US07326972B2 Interconnect structure in integrated circuits Public/Granted day:2008-02-05
Information query
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