There is provided a strap-bonding machine, including a metal ribbon tape storage portion configured to hold a metal ribbon tape, a metal ribbon tape-cutting portion configured to cut the metal ribbon tape fed from the metal ribbon tape storage portion to a metal strap having a predefined shape, a metal strap-carrying portion configured to feed the metal strap to a picking-position, a lead frame-carrying portion configured to carry a lead frame mounted a semiconductor chip on and having a lead terminal, and a bonding portion configured to pick up the metal strap at the picking-position, to carry the metal strap above the lead frame and to bond the metal strap to the semiconductor chip and the lead terminal.