公开(公告)号：US20060016855A1

公开(公告)日：2006-01-26

申请号：US11179596

申请日：2005-07-13

申请人： Shigeru Tanabe ,  Masataka Namba ,  Kaoru Nakamura ,  Kosuke Tosa

发明人： Shigeru Tanabe ,  Masataka Namba ,  Kaoru Nakamura ,  Kosuke Tosa

IPC分类号： B23K37/00

CPC分类号： H01L23/49524 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/4825 ,  H01L21/67144 ,  H01L23/49562 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/744 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48

摘要： There is provided a strap-bonding machine, including a metal ribbon tape storage portion configured to hold a metal ribbon tape, a metal ribbon tape-cutting portion configured to cut the metal ribbon tape fed from the metal ribbon tape storage portion to a metal strap having a predefined shape, a metal strap-carrying portion configured to feed the metal strap to a picking-position, a lead frame-carrying portion configured to carry a lead frame mounted a semiconductor chip on and having a lead terminal, and a bonding portion configured to pick up the metal strap at the picking-position, to carry the metal strap above the lead frame and to bond the metal strap to the semiconductor chip and the lead terminal.

摘要翻译： 提供了一种带状粘合机，包括金属带状收纳部，其配置为保持金属带状带;金属带切割部，其构造成将从金属带状带收纳部供给的金属带带切断成金属带 具有预定形状的金属带承载部分，被配置为将金属带馈送到拾取位置;引线框架承载部分，构造成承载安装有半导体芯片并具有引线端子的引线框架，以及接合部分 被配置为在拾取位置拾取金属带，以将金属带携带在引线框架上方并将金属带接合到半导体芯片和引线端子。