发明申请
US20060017156A1 Method for mounting a chip on a base and arrangement produced by this method
有权
将芯片安装在基座上的方法和通过该方法制造的布置
- 专利标题： Method for mounting a chip on a base and arrangement produced by this method
- 专利标题（中）： 将芯片安装在基座上的方法和通过该方法制造的布置
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申请号： US11184532申请日： 2005-07-19
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公开(公告)号： US20060017156A1公开(公告)日： 2006-01-26
- 发明人: Martin Reiss , Juergen Grafe , Anton Legen , Manuel Carmona
- 申请人： Martin Reiss , Juergen Grafe , Anton Legen , Manuel Carmona
- 优先权： DE102004034884.7 20040719; DE102005015036.5 20050331
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.