公开(公告)号：US07368322B2

公开(公告)日：2008-05-06

申请号：US11184532

申请日：2005-07-19

申请人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

发明人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

摘要翻译： 电子部件包括通过彼此间隔开并且布置在芯片和基部之间的中间空间中的多个粘合剂焊盘附接到基部的基部和芯片。 芯片与基座的互连电连接。 粘合垫在芯片的整个表面区域上以规则分布分隔。 模塑料围绕芯片并且设置在芯片和基座之间的中间空间中。

公开(公告)号：US20060017156A1

公开(公告)日：2006-01-26

申请号：US11184532

申请日：2005-07-19

申请人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

发明人： Martin Reiss ,  Juergen Grafe ,  Anton Legen ,  Manuel Carmona

IPC分类号： H01L23/34

CPC分类号： H01L25/50 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

摘要翻译： 电子部件包括通过彼此间隔开并且布置在芯片和基部之间的中间空间中的多个粘合剂焊盘附接到基部的基部和芯片。 芯片与基座的互连电连接。 粘合垫在芯片的整个表面区域上以规则分布分隔。 模塑料围绕芯片并且设置在芯片和基座之间的中间空间中。

公开(公告)号：US08410595B2

公开(公告)日：2013-04-02

申请号：US11966960

申请日：2007-12-28

申请人： Steffen Kroehnert ,  Kerstin Nocke ,  Juergen Grafe ,  Kashi Vishwanath Machani

发明人： Steffen Kroehnert ,  Kerstin Nocke ,  Juergen Grafe ,  Kashi Vishwanath Machani

IPC分类号： H01L23/055

CPC分类号： H01L23/13 ,  H01L21/4871 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.

摘要翻译： 公开了一种半导体器件。 至少一个半导体芯片安装在基板上并与基板的接触元件接触。 半导体芯片的封装包括在连接的基板和盖内的基板，盖和凹槽。 该口袋能够将芯片固定在其位置，并且该盖由与基底相同的材料组成。

公开(公告)号：US20080029884A1

公开(公告)日：2008-02-07

申请号：US11462322

申请日：2006-08-03

申请人： Juergen Grafe ,  Kimyung Yoon ,  Peter Poechmueller ,  Andre Hanke

发明人： Juergen Grafe ,  Kimyung Yoon ,  Peter Poechmueller ,  Andre Hanke

IPC分类号： H01L23/34

CPC分类号： H01L25/0657 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06586 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Multichip devices and methods of making the same. In one embodiment, a chip stack is sandwiched between first and second redistribution substrates. The chip stack is electrically connected to contact structures of the first redistribution substrate and the second redistribution substrate.

摘要翻译： 多芯片器件及其制作方法。 在一个实施例中，芯片堆叠夹在第一和第二再分配基板之间。 芯片堆叠电连接到第一再分配衬底和第二再分布衬底的接触结构。

公开(公告)号：US07023097B2

公开(公告)日：2006-04-04

申请号：US10927952

申请日：2004-08-27

申请人： Jochen Thomas ,  Juergen Grafe ,  Ingo Wennemuth ,  Minka Gospodinova-Daltcheva ,  Maksim Kuzmenka

发明人： Jochen Thomas ,  Juergen Grafe ,  Ingo Wennemuth ,  Minka Gospodinova-Daltcheva ,  Maksim Kuzmenka

IPC分类号： H01L23/48

CPC分类号： H01L24/97 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The invention relates to an FBGA arrangement, comprising a substrate on which at least one chip is chip-bonded face-down, which has a central row of bonding pads connected to contact islands (landing pads) on the substrate by a bonding channel in the substrate via wire bridges, which substrate, for its part, is provided with soldering balls—arranged in an array—for contact connection to a printed circuit board, and the contact islands and the soldering balls being connected to one another via a rewiring of the substrate. The preferred embodiment of the invention is intended to provide an FBGA arrangement which supports the center pad row technology and at the same time has low electrical parasitics. This is achieved by virtue of the fact that at least two substrates (1, 2) are provided, the substrates (1, 2) are provided substratewise in each case with bonding channels (3, 4) having different dimensions, in a manner forming a multistage bonding channel, the bonding channels (3) in the ball-side substrate (2) having larger dimensions than those in the chip-side substrate (1).

摘要翻译： 本发明涉及一种FBGA布置，其包括基板，其上至少一个芯片正面朝下地被芯片接合，该基板具有通过所述基板中的接合通道连接到所述基板上的接触岛（着陆焊盘）的中心排的接合焊盘 衬底通过导线桥接器，该衬底为其部分设置有排列成阵列的焊球，用于与印刷电路板的接触连接，并且接触岛和焊球通过重新布线 基质。 本发明的优选实施例旨在提供一种支持中心焊盘行技术并同时具有低电寄生效应的FBGA布置。 这是通过提供至少两个基板（1,2）的事实来实现的，基板（1,2）以每种形式设置成具有不同尺寸的接合通道（3,4），以形成 多级接合通道，所述球侧基板（2）中的接合通道（3）的尺寸大于所述芯片侧基板（1）的尺寸。

公开(公告)号：US08004072B2

公开(公告)日：2011-08-23

申请号：US12252244

申请日：2008-10-15

申请人： Harry Hedler ,  Juergen Grafe ,  Steffen Kroehnert

发明人： Harry Hedler ,  Juergen Grafe ,  Steffen Kroehnert

IPC分类号： H01L23/495

CPC分类号： H01L23/49816 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/48 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Packaging systems and methods for semiconductor devices are disclosed. In one embodiment, a packaging system includes a first plate having a first coefficient of thermal expansion (CTE). An integrated circuit is mountable to the first plate. The packaging system includes a second plate coupleable over the first plate over the integrated circuit. The second plate has a second CTE that is substantially a same CTE as the first CTE. A plurality of solder balls is coupleable to the first plate or the second plate and to the integrated circuit.

摘要翻译： 公开了用于半导体器件的封装系统和方法。 在一个实施例中，包装系统包括具有第一热膨胀系数（CTE）的第一板。 集成电路可安装到第一板。 该封装系统包括可跨接在集成电路上的第一板上的第二板。 第二板具有与第一CTE基本相同的CTE的第二CTE。 多个焊球可耦合到第一板或第二板和集成电路。

公开(公告)号：US20080157330A1

公开(公告)日：2008-07-03

申请号：US11966960

申请日：2007-12-28

申请人： Steffen Kroehnert ,  Kerstin Nocke ,  Juergen Grafe ,  Kashi Vishwanath Machani

发明人： Steffen Kroehnert ,  Kerstin Nocke ,  Juergen Grafe ,  Kashi Vishwanath Machani

IPC分类号： H01L23/055

CPC分类号： H01L23/13 ,  H01L21/4871 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.

摘要翻译： 公开了一种半导体器件。 至少一个半导体芯片安装在基板上并与基板的接触元件接触。 半导体芯片的封装包括在连接的基板和盖内的基板，盖和凹槽。 该口袋能够将芯片固定在其位置，并且该盖由与基底相同的材料组成。

公开(公告)号：US20070001291A1

公开(公告)日：2007-01-04

申请号：US11267536

申请日：2005-11-04

申请人： Soo Park ,  Kenneth Rebibis ,  Juergen Grafe

发明人： Soo Park ,  Kenneth Rebibis ,  Juergen Grafe

IPC分类号： H01L23/34

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An anti-warp heat spreader for semiconductor devices is disclosed, wherein the heat spreader is made of a metal sheet of substantially constant thickness, the metal sheet being perforated by at least one opening to allow for the percolation of an adhesive or a resin. The heat spreader is designed to strengthen the package by providing a strong bond between its components, i.e., the circuit board, die, heat spreader and reinforcing frame. At the same time the heat generated by the die during operation is efficiently dissipated. The heat spreader can easily be attached to the die by positioning it in the mold used to produce the reinforcing frame and then fill the mold with a mold compound. The mold compound will easily flow through the opening or openings, thereby filling the gap between the heat spreader and the die. The mold compound replaces the air that escapes from the gap through the opening or openings. Thus, a strong and intense connection between the die and the heat spreader is constituted. The bonding layer underneath the heat spreader and the reinforcing frame above the heat spreader are firmly. interconnected through the opening or openings.

摘要翻译： 公开了一种用于半导体器件的防翘板散热器，其中散热器由厚度基本恒定的金属片制成，该金属片由至少一个开口穿孔以允许粘合剂或树脂的渗透。 散热器设计成通过在其部件即电路板，模具，散热器和加强框架之间提供强大的结合来加强封装。 同时，在操作期间由模具产生的热量被有效地消散。 散热器可以通过将其定位在用于制造加强框架的模具中并且然后用模具化合物填充模具来容易地附接到模具。 模具化合物将容易地流过开口或开口，从而填充散热器和模具之间的间隙。 模具化合物代替通过开口或开口从间隙逸出的空气。 因此，构成了模具和散热器之间的强烈和紧密的连接。 散热器下方的粘合层和散热器上方的加强框架牢固。 通过开口或开口相互连接。

公开(公告)号：US20050098870A1

公开(公告)日：2005-05-12

申请号：US10927952

申请日：2004-08-27

申请人： Jochen Thomas ,  Juergen Grafe ,  Ingo Wennemuth ,  Minka Gospodinova-Daltcheva ,  Maksim Kuzmenka

发明人： Jochen Thomas ,  Juergen Grafe ,  Ingo Wennemuth ,  Minka Gospodinova-Daltcheva ,  Maksim Kuzmenka

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/02

CPC分类号： H01L24/97 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The invention relates to an FBGA arrangement, comprising a substrate on which at least one chip is chip-bonded face-down, which has a central row of bonding pads connected to contact islands (landing pads) on the substrate by a bonding channel in the substrate via wire bridges, which substrate, for its part, is provided with soldering balls—arranged in an array—for contact connection to a printed circuit board, and the contact islands and the soldering balls being connected to one another via a rewiring of the substrate. The preferred embodiment of the invention is intended to provide an FBGA arrangement which supports the center pad row technology and at the same time has low electrical parasitics. This is achieved by virtue of the fact that at least two substrates (1, 2) are provided, the substrates (1, 2) are provided substratewise in each case with bonding channels (3, 4) having different dimensions, in a manner forming a multistage bonding channel, the bonding channels (3) in the ball-side substrate (2) having larger dimensions than those in the chip-side substrate (1).

摘要翻译： 本发明涉及一种FBGA布置，其包括基板，其上至少一个芯片正面朝下地被芯片接合，该基板具有通过所述基板中的接合通道连接到所述基板上的接触岛（着陆焊盘）的中心排的接合焊盘 衬底通过导线桥接器，该衬底为其部分设置有排列成阵列的焊球，用于与印刷电路板的接触连接，并且接触岛和焊球通过重新布线 基质。 本发明的优选实施例旨在提供一种支持中心焊盘行技术并同时具有低电寄生效应的FBGA布置。 这是通过提供至少两个基板（1,2）的事实来实现的，基板（1,2）以每种形式设置成具有不同尺寸的接合通道（3,4），以形成 多级接合通道，所述球侧基板（2）中的接合通道（3）的尺寸大于所述芯片侧基板（1）的尺寸。

公开(公告)号：US20100090322A1

公开(公告)日：2010-04-15

申请号：US12252244

申请日：2008-10-15

申请人： Harry Hedler ,  Juergen Grafe ,  Steffen Kroehnert

发明人： Harry Hedler ,  Juergen Grafe ,  Steffen Kroehnert

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49816 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/48 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Packaging systems and methods for semiconductor devices are disclosed. In one embodiment, a packaging system includes a first plate having a first coefficient of thermal expansion (CTE). An integrated circuit is mountable to the first plate. The packaging system includes a second plate coupleable over the first plate over the integrated circuit. The second plate has a second CTE that is substantially a same CTE as the first CTE. A plurality of solder balls is coupleable to the first plate or the second plate and to the integrated circuit.

摘要翻译： 公开了用于半导体器件的封装系统和方法。 在一个实施例中，包装系统包括具有第一热膨胀系数（CTE）的第一板。 集成电路可安装到第一板。 该封装系统包括可跨接在集成电路上的第一板上的第二板。 第二板具有与第一CTE基本相同的CTE的第二CTE。 多个焊球可耦合到第一板或第二板和集成电路。