发明申请
- 专利标题: Deposition repeatability of PECVD films
- 专利标题(中): PECVD膜的沉积重复性
-
申请号: US10898472申请日: 2004-07-23
-
公开(公告)号: US20060019031A1公开(公告)日: 2006-01-26
- 发明人: Gaku Furuta , Tae Won , John White
- 申请人: Gaku Furuta , Tae Won , John White
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 主分类号: C23C16/00
- IPC分类号: C23C16/00
摘要:
We have a method of improving the deposition rate uniformity of the chemical vapor deposition (CVD) of films when a number of substrates are processed in series, sequentially in a deposition chamber. The method includes the plasma pre-heating of at least one processing volume structure within the processing volume which surrounds the substrate when the substrate is present in the deposition chamber. We also have a device-controlled method which adjusts the deposition time for a few substrates at the beginning of the processing of a number of substrates in series, sequentially in a deposition chamber, so that the deposited film thickness remains essentially constant during processing of the series of substrates. A combination of these methods into a single method provides the best overall results in terms of controlling average film thickness from substrate to substrate.
公开/授权文献
信息查询
IPC分类: