A wire sawing apparatus includes a plurality of cutting wires arranged in parallel with one another and caused to travel in their axial directions; a table on which a workpiece is placed and held; a moving device for vertically moving the table; and a machining-liquid feed pipe. While a machining liquid is falling from a machining-liquid feed opening of the machining-liquid feed pipe, the moving device causes the workpiece to be pressed against the traveling cutting wires, thereby cutting the workpiece. The wire sawing apparatus further includes a plurality of strip members attached to and hanging from the machining-liquid feed pipe. The strip members control the geometry of the machining liquid falling from the machining-liquid feed pipe such that the machining liquid falls substantially vertically without concentrating toward the center.