发明申请
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US11246267申请日： 2005-10-11
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公开(公告)号： US20060030076A1公开(公告)日： 2006-02-09
- 发明人: Hiroshi Kobayashi , Naoki Ishikawa , Kenji Kobae , Hidehiko Kira , Norio Kainuma , Shuichi Takeuchi , Takayoshi Matsumura
- 申请人： Hiroshi Kobayashi , Naoki Ishikawa , Kenji Kobae , Hidehiko Kira , Norio Kainuma , Shuichi Takeuchi , Takayoshi Matsumura
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2003-169607 20030613
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/44 ; H01L21/50
摘要：
The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.
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