公开(公告)号：US08299925B2

公开(公告)日：2012-10-30

申请号：US12180117

申请日：2008-07-25

申请人： Hiroshi Kobayashi ,  Kenji Kobae

发明人： Hiroshi Kobayashi ,  Kenji Kobae

IPC分类号： G08B13/14 ,  H01R43/00 ,  B44C1/165 ,  H01L23/02 ,  H01L23/52

CPC分类号： G06K19/07745 ,  G06K19/072 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00

摘要： The RFID tag has a base sheet having a recess, a first element provided on the base sheet astride the recess, a second element which is provided between the first element and the base sheet and which is electrically connected to the first element, and a communication antenna which is provided on the base sheet and which is connected to at least any of the first element and the second element.

摘要翻译： 所述RFID标签具有基片，所述基片具有凹部，所述第一元件跨越所述凹部设置在所述基片上，所述第二元件设置在所述第一元件与所述基片之间，并且与所述第一元件电连接， 天线，其设置在基片上并且连接到第一元件和第二元件中的至少任一个。

公开(公告)号：US20110079896A1

公开(公告)日：2011-04-07

申请号：US12892029

申请日：2010-09-28

申请人： Yoshiyuki SATOH ,  Kenji KOBAE ,  Kimio NAKAMURA ,  Takayoshi MATSUMURA ,  Kuniko ISHIKAWA

发明人： Yoshiyuki SATOH ,  Kenji KOBAE ,  Kimio NAKAMURA ,  Takayoshi MATSUMURA ,  Kuniko ISHIKAWA

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L21/56 ,  H01L24/12 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/0665

摘要： A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：在要安装半导体芯片的衬底的电极上形成焊料部分; 将树脂层施加到基板上以使得焊料部分的顶部区域暴露的厚度; 固化树脂层; 在要安装半导体芯片的区域上提供热固性底部填充材料; 将所述半导体芯片的电极朝向所述焊料部分，使得所述电极面向所述焊料部分; 并加热底部填充材料和焊料部分。

公开(公告)号：US20100243743A1

公开(公告)日：2010-09-30

申请号：US12723174

申请日：2010-03-12

申请人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Takayoshi MATSUMURA ,  Tetsuya TAKAHASHI

发明人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Takayoshi MATSUMURA ,  Tetsuya TAKAHASHI

IPC分类号： G06K19/077 ,  G06K19/02 ,  B29C65/02 ,  B29C65/48

CPC分类号： G06K19/07749 ,  G06K19/07728

摘要： A radio frequency identification tag is provided. The radio frequency identification tag includes a base, an antenna formed on the base, an integrated circuit chip electrically connected to the antenna, and a bonding layer bonding the integrated circuit chip to the base. The bonding layer includes a conductive filler. The base is configured to bend away from a surface on which the integrated circuit chip is bonded.

摘要翻译： 提供射频识别标签。 射频识别标签包括基座，形成在基座上的天线，与天线电连接的集成电路芯片，以及将集成电路芯片接合到基座的接合层。 接合层包括导电填料。 该基座被构造为远离集成电路芯片所接合的表面弯曲。

公开(公告)号：US20100001387A1

公开(公告)日：2010-01-07

申请号：US12559219

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L23/16 ,  G06K19/077 ,  G06K19/07728 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16

摘要： An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 以及与导体图形电连接的电路芯片。 该电子设备还包括一个加强件，该加强件设置在基座上以围绕电路芯片，其外形像环形，并且包括沿基座的厚度方向堆叠的层。 层的最下层最靠近基底并且比作为剩余层中的至少一层的层更柔软。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US07582553B2

公开(公告)日：2009-09-01

申请号：US11359426

申请日：2006-02-23

申请人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

发明人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

IPC分类号： H01L21/44

CPC分类号： H01L21/4853

摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.

摘要翻译： 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于 垫子 以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

公开(公告)号：US20090146653A1

公开(公告)日：2009-06-11

申请号：US12292651

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

公开(公告)号：US20090109000A1

公开(公告)日：2009-04-30

申请号：US12180117

申请日：2008-07-25

申请人： Hiroshi KOBAYASHI ,  Kenji KOBAE

发明人： Hiroshi KOBAYASHI ,  Kenji KOBAE

IPC分类号： H04Q5/22 ,  H01Q17/00

CPC分类号： G06K19/07745 ,  G06K19/072 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00

摘要： The RFID tag has a base sheet having a recess, a first element provided on the base sheet astride the recess, a second element which is provided between the first element and the base sheet and which is electrically connected to the first element, and a communication antenna which is provided on the base sheet and which is connected to at least any of the first element and the second element.

摘要翻译： 所述RFID标签具有基片，所述基片具有凹部，所述第一元件跨越所述凹部设置在所述基片上，所述第二元件设置在所述第一元件与所述基片之间，并且与所述第一元件电连接， 天线，其设置在基片上并且连接到第一元件和第二元件中的至少任一个。

公开(公告)号：US20090053852A1

公开(公告)日：2009-02-26

申请号：US12192225

申请日：2008-08-15

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takashi Kubota ,  Hiroshi Kobayashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takashi Kubota ,  Hiroshi Kobayashi

IPC分类号： H05K3/30 ,  H05K13/04

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T29/4913 ,  Y10T29/5313 ,  H01L2924/00

摘要： A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mounting board, bringing the one surface of the sheet into contact with a back surface of the electronic component mounted on the mounting board and charging the adhesive into the space by bringing the adhesive into contact with a peripheral portion of the electronic component under a low pressure, and pressing a heating head against the other surface of the sheet and heating the sheet with the heating head via the sheet to set the adhesive under atmospheric pressure, in a state that the sheet is in contact with the electronic component.

摘要翻译： 提供了一种用于电子设备和制造设备的制造方法。 制造方法包括向片材的表面施加要填充到安装板和安装在安装板上的电子部件之间的空间中的粘合剂，使片材的一个表面与电子部件的背面接触 安装在安装板上，并通过使粘合剂在低压下与电子部件的周边部分接触来将粘合剂装入空间，并将加热头压在片材的另一个表面上并加热片材 在片材与电子部件接触的状态下，经由片材头部，以在大气压下设置粘合剂。

公开(公告)号：US07416921B2

公开(公告)日：2008-08-26

申请号：US11066483

申请日：2005-02-28

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Kimio Nakamura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura ,  Kimio Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75753 ,  H01L2224/81205 ,  H01L2224/81232 ,  H01L2224/81801 ,  H01L2224/83099 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/19043 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip 52 includes a step of providing a hardening trigger that is not heat to insulating adhesive 51 either before the semiconductor chip 52 is mounted on the substrate 50 or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate 50 by pressure welding or metal combining while hardening of the insulating adhesive 51 is progressing due to provision of the hardening trigger.

摘要翻译： 半导体芯片的倒装芯片的安装方法可以在常温下进行接合，提高接合的位置精度。 半导体芯片52的倒装芯片接合的方法包括在将半导体芯片52安装在基板50上之前或在接合期间提供不加热以绝缘粘合剂51的硬化触发的步骤; 以及通过压力焊接或金属组合将半导体芯片的凸点接合到基板50的焊盘的步骤，同时绝缘粘合剂51的硬化由于设置硬化触发而正在进行。

公开(公告)号：US07394163B2

公开(公告)日：2008-07-01

申请号：US10187843

申请日：2002-07-03

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L21/67092 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.

摘要翻译： 通过用作底层填充剂的粘合剂填充芯片和基板之间的间隙来安装半导体芯片的方法，其中安装IC芯片。 底部填充物的圆角被制成具有优选的形状。 为了实现这一点，将具有凸块的头IC芯片放置在被底部填充胶粘剂覆盖的悬挂上，并设置有垫。 接合工具按压头IC芯片并对头IC芯片施加超声波振荡，使得凸块适当地粘合到焊盘。 当头部IC芯片被按压并进行超声波振荡时，发射紫外线108以使在头IC芯片11和悬架12之间展开的粘合剂151的周边部分151a硬化。