公开(公告)号：US07982295B2

公开(公告)日：2011-07-19

申请号：US12559234

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L23/02

CPC分类号： H01L23/24 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且包括作为内部结构的同心环。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US07833831B2

公开(公告)日：2010-11-16

申请号：US11951693

申请日：2007-12-06

申请人： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

发明人： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

IPC分类号： H01L21/00

CPC分类号： B23K1/06 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0285 ,  H05K2203/0338 ,  H05K2203/1105 ,  Y10T428/12493 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

摘要翻译： 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。

公开(公告)号：US07566586B2

公开(公告)日：2009-07-28

申请号：US11634119

申请日：2006-12-06

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

公开(公告)号：US20090146652A1

公开(公告)日：2009-06-11

申请号：US12292650

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US20080225433A1

公开(公告)日：2008-09-18

申请号：US12128985

申请日：2008-05-29

申请人： Takayoshi MATSUMURA ,  Naoki ISHIKAWA ,  Hiroshi KOBAYASHI ,  Hidehiko KIRA

发明人： Takayoshi MATSUMURA ,  Naoki ISHIKAWA ,  Hiroshi KOBAYASHI ,  Hidehiko KIRA

IPC分类号： G11B5/012

CPC分类号： B21D39/06 ,  G11B5/4806

摘要： A method and apparatus for assembling a carriage assembly attach suspensions to carriage arms without deformation and with higher accuracy than with the conventional art.Suspensions are placed on carriage arms by aligning engagement holes 10a provided in the carriage arms and spacer holes provided in spacer portions of the suspension. A bar-shaped operation member whose outer diameter is equal to or smaller than the inner diameter of the spacer holes is inserted into the spacer holes and longitudinal ultrasonic vibration is applied to the bar-shaped operation member to cause expanding and contracting motion in the radial direction of the spacer hole, so that when the diameter of the operation member expands, the operation member contacts edge portions of the spacer holes of the spacer portions and crimps the edge portions to fix the suspensions to the carriage arms.

摘要翻译： 用于组装滑架组件的方法和装置将悬架安装到托架臂上而不变形，并且具有比常规技术更高的精度。 悬架通过对准设置在托架臂中的接合孔10a和设置在悬架的间隔件部分中的间隔孔而放置在托架臂上。 将外径等于或小于间隔孔的内径的棒状操作构件插入到间隔孔中，并且向棒状操作构件施加纵向超声波振动，以在径向上引起膨胀和收缩运动 使得当操作构件的直径膨胀时，操作构件接触间隔件部分的间隔孔的边缘部分并且卷曲边缘部分以将悬架固定到托架臂上。

公开(公告)号：US07424966B2

公开(公告)日：2008-09-16

申请号：US11062789

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K1/06 ,  B23K5/20 ,  B23K37/00

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

公开(公告)号：US20060131426A1

公开(公告)日：2006-06-22

申请号：US11091934

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G06K19/06 ,  G08B13/14 ,  H01Q17/00

CPC分类号： H01L24/12 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49018 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计成防止凸起的下沉。 当电路芯片连接到天线时，用于限制由压力引起的电路芯片的凸块的下沉的止动器设置在电路芯片或与凸块相邻的位置的基座上。

公开(公告)号：US20060090833A1

公开(公告)日：2006-05-04

申请号：US11041375

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B32B37/00 ,  B29C65/00 ,  B29C65/08

CPC分类号： B23K20/106 ,  B23K20/10 ,  B23K2101/42 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014

摘要： The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

摘要翻译： 超声波安装方法能够将电子部件的凸块均匀地接合到电路板，并且提高超声波安装电子部件的可靠性。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 超声波振动沿平行于电子部件的表面的方向施加，并且负载与超声波振动的振动循环一起垂直地施加到电子部件的表面。

公开(公告)号：US20060030076A1

公开(公告)日：2006-02-09

申请号：US11246267

申请日：2005-10-11

申请人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

IPC分类号： H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.

摘要翻译： 本发明的半导体器件能够限制合金化金属和改善半导体芯片和安装基板之间的电连接。 半导体器件包括：具有端子部分的半导体芯片; 以及用于电连接的凸块，在端子部分处形成凸点。 每个凸块由包括芯构件和护套构件的双层线制成，并且通过柱凸块接合工艺形成。

公开(公告)号：US20050196703A1

公开(公告)日：2005-09-08

申请号：US11117308

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  G03C1/725

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

摘要翻译： 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤：对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。