Invention Application
- Patent Title: Three dimensional integrated circuit and method of design
- Patent Title (中): 三维集成电路及设计方法
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Application No.: US10919121Application Date: 2004-08-16
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Publication No.: US20060033110A1Publication Date: 2006-02-16
- Inventor: Syed Alam , Ibrahim Elfadel , Kathryn Guarini , Meikei Ieong , Prabhakar Kudva , David Kung , Mark Lavin , Arifur Rahman
- Applicant: Syed Alam , Ibrahim Elfadel , Kathryn Guarini , Meikei Ieong , Prabhakar Kudva , David Kung , Mark Lavin , Arifur Rahman
- Main IPC: H01L29/04
- IPC: H01L29/04
Abstract:
A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
Public/Granted literature
- US07312487B2 Three dimensional integrated circuit Public/Granted day:2007-12-25
Information query
IPC分类:
