公开(公告)号：US20070057384A1

公开(公告)日：2007-03-15

申请号：US11226025

申请日：2005-09-14

Applicant: Syed Alam ,  Robert Jones ,  Scott Pozder

Inventor： Syed Alam ,  Robert Jones ,  Scott Pozder

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541

Abstract: A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die or wafer allows the stacked die to have a reciprocal orientation with respect to each other which may be used to decrease the interconnect required between the vertically stacked die and or wafers. Flipping and/or rotating may also be used to improve heat dissipation when wafer and/or die are stacked. The stacked wafers or die may then be packaged.

Abstract translation: 互易设计对称性允许晶片上的堆叠晶片或晶片使用仅仅几层（例如，金属互连层）变化的相同设计或设计。 翻转或旋转一个模具或晶片允许堆叠的模具相对于彼此具有相互的取向，其可用于减小垂直堆叠的模具和/或晶片之间所需的互连。 当晶片和/或管芯堆叠时，翻转和/或旋转也可用于改善散热。 然后可以包装堆叠的晶片或管芯。

公开(公告)号：US20100219155A1

公开(公告)日：2010-09-02

申请号：US12527864

申请日：2008-02-18

Applicant: Khurshid Syed Alam ,  Evgeni Gousev ,  Marc Maurice Mignard ,  David Heald ,  Ana R. Londergan ,  Philip Don Floyd

Inventor： Khurshid Syed Alam ,  Evgeni Gousev ,  Marc Maurice Mignard ,  David Heald ,  Ana R. Londergan ,  Philip Don Floyd

IPC: C23F1/08 ,  C23F1/00

CPC classification number: H01L21/67069 ,  B81B2201/047 ,  B81C1/00531

Abstract: Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.

Abstract translation: 本文公开了蚀刻设备和方法，用于从永久MEMS结构之间更有效地蚀刻牺牲材料。 蚀刻头包括细长的蚀刻剂入口结构，其可以是槽形的或入口孔的细长分布。 衬底以限定基本上平行于衬底面的流动路径的方式支撑在蚀刻头附近，并且允许蚀刻头相对于衬底扫描的相对运动。

公开(公告)号：US20130314312A1

公开(公告)日：2013-11-28

申请号：US13480377

申请日：2012-05-24

Applicant: Russell Wayne Gruhlke ,  Ying Zhou ,  Khurshid Syed Alam ,  John Michael Wyrwas ,  Ron Lee Feldman ,  Kollengode Subramanian Narayanan ,  James Randolph Webster

Inventor： Russell Wayne Gruhlke ,  Ying Zhou ,  Khurshid Syed Alam ,  John Michael Wyrwas ,  Ron Lee Feldman ,  Kollengode Subramanian Narayanan ,  James Randolph Webster

IPC: G09G5/00

CPC classification number: G02B6/0036 ,  G06F3/0421 ,  G06F2203/04108

Abstract: This disclosure relates to an interactive display, having a front surface including a viewing area, and providing an input/output interface for a user of an electronic device. A planar light guide (PLG) disposed substantially parallel to the front surface, has a periphery at least coextensive with the viewing area. A light-emitting source (LES), disposed outside the periphery of the PLG, is optically coupled with a PLG input. The PLG outputs reflected light, in a direction substantially orthogonal to the front surface, by reflecting light received from the LES. A light collecting device (LCD) collects scattered light that results from interaction of the reflected light with a user-controlled object. The LCD redirects the collected scattered light toward one or more light sensors. A processor recognizes, from outputs of the light sensors, an instance of a user gesture, and controls the interactive display and/or electronic device, responsive to the user gesture.

Abstract translation: 本公开涉及具有包括观看区域的前表面以及为电子设备的用户提供输入/输出接口的交互式显示器。 基本上平行于前表面设置的平面光导（PLG）具有与观察区域至少共同延伸的周边。 设置在PLG外围的发光源（LES）与PLG输入光学耦合。 PLG通过反射从LES接收的光，在基本上正交于前表面的方向上输出反射光。 集光装置（LCD）收集由反射光与用户控制物体的相互作用产生的散射光。 LCD将所收集的散射光重定向到一个或多个光传感器。 处理器从光传感器的输出识别用户手势的实例，并且响应于用户手势来控制交互式显示和/或电子设备。

公开(公告)号：US09726803B2

公开(公告)日：2017-08-08

申请号：US13480377

申请日：2012-05-24

Applicant: Russell Wayne Gruhlke ,  Ying Zhou ,  Khurshid Syed Alam ,  John Michael Wyrwas ,  Ron Lee Feldman ,  Kollengode Subramanian Narayanan ,  James Randolph Webster

Inventor： Russell Wayne Gruhlke ,  Ying Zhou ,  Khurshid Syed Alam ,  John Michael Wyrwas ,  Ron Lee Feldman ,  Kollengode Subramanian Narayanan ,  James Randolph Webster

IPC: G06G5/00 ,  F21V8/00 ,  G06F3/042

CPC classification number: G02B6/0036 ,  G06F3/0421 ,  G06F2203/04108

Abstract: This disclosure relates to an interactive display, having a front surface including a viewing area, and providing an input/output interface for a user of an electronic device. A planar light guide (PLG) disposed substantially parallel to the front surface, has a periphery at least coextensive with the viewing area. A light-emitting source (LES), disposed outside the periphery of the PLG, is optically coupled with a PLG input. The PLG outputs reflected light, in a direction substantially orthogonal to the front surface, by reflecting light received from the LES. A light collecting device (LCD) collects scattered light that results from interaction of the reflected light with a user-controlled object. The LCD redirects the collected scattered light toward one or more light sensors. A processor recognizes, from outputs of the light sensors, an instance of a user gesture, and controls the interactive display and/or electronic device, responsive to the user gesture.

公开(公告)号：US08536059B2

公开(公告)日：2013-09-17

申请号：US12527864

申请日：2008-02-18

Applicant: Khurshid Syed Alam ,  Evgeni Gousev ,  Marc Maurice Mignard ,  David Heald ,  Ana R. Londergan ,  Philip Don Floyd

Inventor： Khurshid Syed Alam ,  Evgeni Gousev ,  Marc Maurice Mignard ,  David Heald ,  Ana R. Londergan ,  Philip Don Floyd

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L21/67069 ,  B81B2201/047 ,  B81C1/00531

Abstract: Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.

Abstract translation: 本文公开了蚀刻设备和方法，用于从永久MEMS结构之间更有效地蚀刻牺牲材料。 蚀刻头包括细长的蚀刻剂入口结构，其可以是槽形的或入口孔的细长分布。 衬底以限定基本上平行于衬底面的流动路径的方式支撑在蚀刻头附近，并且允许蚀刻头相对于衬底扫描的相对运动。

公开(公告)号：US20070287224A1

公开(公告)日：2007-12-13

申请号：US11737598

申请日：2007-04-19

Applicant: Syed Alam ,  Ibrahim Elfadel ,  Kathryn Guarini ,  Meikei Ieong ,  Prabhakar Kudva ,  David Kung ,  Mark Lavin ,  Arifur Rahman

Inventor： Syed Alam ,  Ibrahim Elfadel ,  Kathryn Guarini ,  Meikei Ieong ,  Prabhakar Kudva ,  David Kung ,  Mark Lavin ,  Arifur Rahman

IPC: H01L21/02

CPC classification number: H01L27/0688 ,  H01L21/2007 ,  H01L21/84 ,  H01L27/1203

Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

Abstract translation: 三维（3D）集成电路（IC），3D IC芯片和制造3D IC芯片的方法。 该芯片包括多层电路，例如硅绝缘体（SOI）CMOS IC层，每层包括电路元件。 这些层可以平行地形成，并且一层附着到另一层以形成层叠的3D芯片。

公开(公告)号：US20060033110A1

公开(公告)日：2006-02-16

申请号：US10919121

申请日：2004-08-16

Applicant: Syed Alam ,  Ibrahim Elfadel ,  Kathryn Guarini ,  Meikei Ieong ,  Prabhakar Kudva ,  David Kung ,  Mark Lavin ,  Arifur Rahman

Inventor： Syed Alam ,  Ibrahim Elfadel ,  Kathryn Guarini ,  Meikei Ieong ,  Prabhakar Kudva ,  David Kung ,  Mark Lavin ,  Arifur Rahman

IPC: H01L29/04

CPC classification number: H01L27/0688 ,  H01L21/2007 ,  H01L21/84 ,  H01L27/1203

Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

Abstract translation: 三维（3D）集成电路（IC），3D IC芯片和3D IC芯片的制造方法。 该芯片包括多层电路，例如硅绝缘体（SOI）CMOS IC层，每层包括电路元件。 这些层可以平行地形成，并且一层附着到另一层以形成层叠的3D芯片。

公开(公告)号：US20200292699A1

公开(公告)日：2020-09-17

申请号：US16368843

申请日：2019-03-28

Applicant: Syed Alam Abbas ,  Blair Cunningham

Inventor： Syed Alam Abbas ,  Blair Cunningham

IPC: G01S15/66 ,  G01S15/89 ,  G01S15/00 ,  B63B35/04

Abstract: Reflected sonar signals arising from one or more possible unknown objects are distinguished according to a first criterion, and possible shapes each having a defined unique associated point are assigned each of the possible unknown objects. Then the three dimensional points are tracked by the sonar system.

公开(公告)号：US20080042140A1

公开(公告)日：2008-02-21

申请号：US11847608

申请日：2007-08-30

Applicant: Syed Alam ,  Ibrahim Elfadel ,  Kathryn Guarini ,  Meikei Ieong ,  Prabhakar Kudva ,  David Kung ,  Mark Lavin ,  Arifur Rahman

Inventor： Syed Alam ,  Ibrahim Elfadel ,  Kathryn Guarini ,  Meikei Ieong ,  Prabhakar Kudva ,  David Kung ,  Mark Lavin ,  Arifur Rahman

IPC: H01L29/04

CPC classification number: H01L27/0688 ,  H01L21/2007 ,  H01L21/84 ,  H01L27/1203

Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

Abstract translation: 三维（3D）集成电路（IC），3D IC芯片和3D IC芯片的制造方法。 该芯片包括多层电路，例如硅绝缘体（SOI）CMOS IC层，每层包括电路元件。 这些层可以平行地形成，并且一层附着到另一层以形成层叠的3D芯片。