发明申请
- 专利标题： Metal-metal bonding of compliant interconnect
- 专利标题（中）： 金属 - 金属接合兼容互连
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申请号： US10917041申请日： 2004-08-11
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公开(公告)号： US20060033172A1公开(公告)日： 2006-02-16
- 发明人: Sriram Muthukumar , Shriram Ramanathan
- 申请人： Sriram Muthukumar , Shriram Ramanathan
- 主分类号： H01L29/76
- IPC分类号： H01L29/76
摘要：
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.
公开/授权文献
- US07750487B2 Metal-metal bonding of compliant interconnect 公开/授权日：2010-07-06
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