Invention Application
- Patent Title: Integrated patch antenna and electronics assembly and method for fabricating
- Patent Title (中): 集成贴片天线和电子组件及其制造方法
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Application No.: US10936286Application Date: 2004-09-08
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Publication No.: US20060049986A1Publication Date: 2006-03-09
- Inventor: Gregory Dunn , Jeffrey Petsinger , William Ziemer
- Applicant: Gregory Dunn , Jeffrey Petsinger , William Ziemer
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
An integrated patch antenna and electronics assembly (300) comprises an antenna dielectric layer (305), a ground plane layer (310) disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer (315) disposed on the ground plane layer opposite the antenna dielectric layer, a patterned conductive metal foil layer (320) on a component surface (323) of the assembly (300), and a conductive metal foil antenna patch (325) disposed on a second side of the antenna dielectric layer that is in a patch side (391) of the assembly. In some embodiments, a plated through hole (330) couples the antenna patch to the patterned conductive metal foil layer. In some embodiments, there are one or more printed circuit dielectric layers (316, 341, 346, 351) disposed over the antenna patch on the antenna patch side of the assembly. In some embodiments, pairs of printed circuit dielectric layers ([315, 316], [340, 341], [345, 346], [350, 351]) are formed simultaneously on each side of the assembly.
Public/Granted literature
- US07030815B2 Integrated patch antenna and electronics assembly and method for fabricating Public/Granted day:2006-04-18
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