发明申请
- 专利标题： Semiconductor element heat dissipating member, semiconductor device using same and manufacturing same
- 专利标题（中）： 半导体元件散热构件，使用其的半导体器件及其制造
-
申请号： US10538222申请日： 2003-12-09
-
公开(公告)号： US20060057768A1公开(公告)日： 2006-03-16
- 发明人: Kazuyuki Nakanishi , Tadashi Oshima , Hideo Hasegawa , Hiroyuki Mori , Hideo Tachikawa , Yukio Miyachi , Yasushi Yamada , Hiroyuki Ueda , Masayasu Ishiko
- 申请人： Kazuyuki Nakanishi , Tadashi Oshima , Hideo Hasegawa , Hiroyuki Mori , Hideo Tachikawa , Yukio Miyachi , Yasushi Yamada , Hiroyuki Ueda , Masayasu Ishiko
- 申请人地址： JP Aichi 480-1192
- 专利权人： Kabushiki Kaisha Toyota Chuo Kenkyusho
- 当前专利权人： Kabushiki Kaisha Toyota Chuo Kenkyusho
- 当前专利权人地址： JP Aichi 480-1192
- 优先权： JP2002-357076 20021209
- 国际申请： PCT/JP03/15741 WO 20031209
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.
公开/授权文献
信息查询
IPC分类:
