发明申请
- 专利标题： Printed board and manufacturing method thereof
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US11232078申请日： 2005-09-22
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公开(公告)号： US20060068180A1公开(公告)日： 2006-03-30
- 发明人: Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
- 申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
- 申请人地址： JP Kariya-city JP Kawasaki-city
- 专利权人： DENSO CORPORATION,NEC Electronics Corporation
- 当前专利权人： DENSO CORPORATION,NEC Electronics Corporation
- 当前专利权人地址： JP Kariya-city JP Kawasaki-city
- 优先权： JP2004-277790 20040924
- 主分类号： B32B3/00
- IPC分类号： B32B3/00 ; B32B37/00
摘要：
In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
公开/授权文献
- US07323238B2 Printed circuit board having colored outer layer 公开/授权日：2008-01-29
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