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公开(公告)号：US07323238B2
公开(公告)日：2008-01-29
申请号：US11232078
申请日：2005-09-22
申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
发明人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
IPC分类号： B32B3/00
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要翻译： 在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大 比土地和热塑性树脂构件之间的距离大。 在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。 由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。 因此，可以有效地提高土地的识别率。
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2.发明授权Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns 有权用于具有热塑性树脂层和导电图案的半导体器件的封装衬底公开(公告)号：US07378745B2
公开(公告)日：2008-05-27
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译： 具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。 在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。 在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。
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公开(公告)号：US20060068180A1
公开(公告)日：2006-03-30
申请号：US11232078
申请日：2005-09-22
申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
发明人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要翻译： 在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大 比土地和热塑性树脂构件之间的距离大。 在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。 由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。 因此，可以有效地提高土地的识别率。
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4.发明申请Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device 有权用于半导体器件的封装衬底，其制造方法和半导体器件公开(公告)号：US20060044735A1
公开(公告)日：2006-03-02
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H05K1/00
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译： 具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。 在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。 在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。
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