Invention Application
- Patent Title: Semiconductor package structure with microstrip antennan
- Patent Title (中): 具微带天线的半导体封装结构
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Application No.: US10962437Application Date: 2004-10-13
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Publication No.: US20060076658A1Publication Date: 2006-04-13
- Inventor: Sung-Mao Wu
- Applicant: Sung-Mao Wu
- Applicant Address: TW Kaoshiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaoshiung
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/52 ; H01L23/48
Abstract:
A semiconductor package structure with a microstrip antenna comprises a packaging substrate, a chip and a microstrip radiation device. The packaging substrate has an upper surface having a packaging area on which the chip is disposed and a peripheral area on which the microstrip radiation device is disposed for transceiving a signal of the chip.
Public/Granted literature
- US07352056B2 Semiconductor package structure with microstrip antennan Public/Granted day:2008-04-01
Information query
IPC分类:
