发明申请
- 专利标题： Wafer grinding method
- 专利标题（中）： 晶圆磨削法
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申请号： US11244172申请日： 2005-10-06
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公开(公告)号： US20060079155A1公开(公告)日： 2006-04-13
- 发明人: Masaru Nakamura , Yosuke Watanabe , Satoshi Kobayashi , Noboru Takeda , Masanori Yoshida , Takashi Sanpei , Masahiro Murata
- 申请人： Masaru Nakamura , Yosuke Watanabe , Satoshi Kobayashi , Noboru Takeda , Masanori Yoshida , Takashi Sanpei , Masahiro Murata
- 专利权人： Disco Corporation
- 当前专利权人： Disco Corporation
- 优先权： JP2004-295786 20041008
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A wafer grinding method for grinding the surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along the outer periphery at a location on the inside of the outer periphery by a predetermined distance; and a grinding step for grinding the surface to be ground of the wafer whose outer peripheral portion has been removed, to a predetermined finish thickness.
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