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    Laser beam machine
    2.
    发明申请
    Laser beam machine 审中-公开
    激光束机

    公开(公告)号：US20050082267A1

    公开(公告)日：2005-04-21

    申请号：US10950813

    申请日：2004-09-28

    申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

    发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

    IPC分类号： B23K26/00 ,  B23K26/03

    CPC分类号： B23K26/03 ,  B23K2101/40

    摘要： A laser beam machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser to the workpiece held on the chuck table, wherein the machine further comprises a processing sound wave detection means for detecting processing sound waves generated when a laser beam is applied to the workpiece from the laser beam application means and a control means for judging whether a detection signal from the processing sound wave detection means falls within a predetermined permissible range.

    摘要翻译： 一种激光束机，包括用于保持工件的卡盘台和用于将激光施加到保持在卡盘台上的工件的激光束施加装置，其中，该机器还包括处理声波检测装置，用于检测当 激光束从激光束施加装置施加到工件，以及用于判断来自处理声波检测装置的检测信号是否落在预定允许范围内的控制装置。

    Apparatus for checking a laser processed deteriorated layer
    3.
    发明申请
    Apparatus for checking a laser processed deteriorated layer 审中-公开
    用于检查激光加工劣化层的装置

    公开(公告)号：US20050127299A1

    公开(公告)日：2005-06-16

    申请号：US11004818

    申请日：2004-12-07

    申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

    发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

    IPC分类号： B23K26/00 ,  B23K101/40 ,  G03F7/20 ,  H01L21/301 ,  G03B27/42

    CPC分类号： G03F7/70608

    摘要： An apparatus for checking a laser processed deteriorated layer formed in the inside of a workpiece by applying a laser beam capable of passing through the workpiece to the workpiece, comprising a workpiece holding means for holding the workpiece; a light application means for applying light capable of passing through the workpiece held on the workpiece holding means to the exposed surface of the workpiece at a predetermined angle; a light receiving means for receiving light that is applied from the light application, passes through the inside of the workpiece and is reflected from the workpiece; and a display means for displaying the state of light received by the light receiving means.

    摘要翻译： 一种用于通过将能够通过工件的激光束施加到工件来检查在工件内部形成的激光加工劣化层的装置，包括用于保持工件的工件保持装置; 光施加装置，用于施加能够以保持在工件保持装置上的工件以预定角度穿过工件的暴露表面的光; 用于接收从光照射施加的光的光接收装置通过工件内部并从工件反射; 以及显示装置，用于显示由光接收装置接收的光的状态。

    Laser beam machine
    4.
    发明申请
    Laser beam machine 审中-公开
    激光束机

    公开(公告)号：US20050082264A1

    公开(公告)日：2005-04-21

    申请号：US10961219

    申请日：2004-10-12

    申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

    发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Yukio Morishige ,  Masaru Nakamura ,  Masahiro Murata

    IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K101/40 ,  H01L21/301

    CPC分类号： B23K26/032 ,  B23K26/03 ,  B23K26/034 ,  B23K2101/40

    摘要： A laser beam machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a light detection means for detecting light of a processing portion of the workpiece to which a laser beam is applied from the laser beam application means and a control means for judging whether the output value of the light detection means falls within a predetermined permissible range.

    摘要翻译： 一种激光束机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，其中该机器还包括光检测装置，用于检测 从激光束施加装置施加激光束的工件和用于判断光检测装置的输出值是否落在预定容许范围内的控制装置。

    Laser beam processing machine
    5.
    发明授权
    Laser beam processing machine 有权
    激光束加工机

    公开(公告)号：US07538048B2

    公开(公告)日：2009-05-26

    申请号：US11808384

    申请日：2007-06-08

    申请人： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    发明人： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    IPC分类号： H01L21/00

    CPC分类号： B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/0838 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52

    摘要： A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.

    摘要翻译： 一种激光束处理机，包括：路径分布装置，用于将由脉冲激光束振荡装置振荡的脉冲激光束交替地分配到第一路径和第二路径;以及一个激光束，其穿过一条路径并被一个会聚 透镜和通过另一路径并被聚光透镜会聚的另一激光束被施加在彼此沿着光轴方向相互偏移的不同聚焦点处，它们之间的时间间隔交替。

    Laser beam processing machine
    6.
    发明申请
    Laser beam processing machine 有权
    激光束加工机

    公开(公告)号：US20070243696A1

    公开(公告)日：2007-10-18

    申请号：US11808384

    申请日：2007-06-08

    申请人： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    发明人： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    IPC分类号： H01L21/00

    CPC分类号： B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/0838 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52

    摘要： A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.

    摘要翻译： 一种激光束处理机，包括：路径分布装置，用于将由脉冲激光束振荡装置振荡的脉冲激光束交替地分配到第一路径和第二路径;以及一个激光束，其穿过一条路径并被一个会聚 透镜和通过另一路径并被聚光透镜会聚的另一激光束被施加在彼此沿着光轴方向相互偏移的不同聚焦点处，它们之间的时间间隔交替。

    Wafer dividing method
    8.
    发明授权
    Wafer dividing method 有权
    晶圆分割法

    公开(公告)号：US07232741B2

    公开(公告)日：2007-06-19

    申请号：US10968100

    申请日：2004-10-20

    申请人： Yusuke Nagai ,  Masaru Nakamura ,  Satoshi Kobayashi ,  Yukio Morishige

    发明人： Yusuke Nagai ,  Masaru Nakamura ,  Satoshi Kobayashi ,  Yukio Morishige

    IPC分类号： H01L21/46

    CPC分类号： H01L21/3043 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

    摘要： A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.

    摘要翻译： 一种沿着预定分割线分割晶片的方法，包括以下步骤：劣化层形成步骤，用于施加能够沿着分割线穿过晶片的脉冲激光束，以沿着分割线在晶片内部形成劣化层 ; 用于将可延伸保护带固定在劣化层形成步骤之前或之后的晶片的一侧的可延展的保护带固定步骤; 以及分割步骤，用于通过在劣化层形成步骤之后扩展固定在晶片上的保护带，沿着劣化层分割晶片。

    Wafer dividing method
    9.
    发明授权
    Wafer dividing method 有权
    晶圆分割法

    公开(公告)号：US07696010B2

    公开(公告)日：2010-04-13

    申请号：US11639209

    申请日：2006-12-15

    申请人： Kazuma Sekiya ,  Masaru Nakamura ,  Satoshi Kobayashi

    发明人： Kazuma Sekiya ,  Masaru Nakamura ,  Satoshi Kobayashi

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67092 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  B28D5/0094 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327

    摘要： A method of dividing a wafer having devices which are formed in a plurality of areas sectioned by a plurality of dividing lines formed in a lattice pattern on the front surface, into individual devices along the dividing lines, comprising: a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer along the dividing lines by applying a laser beam of a wavelength having permeability for the wafer along the dividing lines; a wafer supporting step for putting the rear surface of the wafer on the surface of an adhesive tape which is mounted on an annular frame and whose adhesive strength is reduced by applying ultraviolet radiation thereto; an adhesive strength reducing step for reducing the adhesive strength of the adhesive tape by applying ultraviolet radiation to the adhesive tape to which the wafer has been affixed; and a dividing step for dividing the wafer into individual devices along the dividing lines where the deteriorated layer has been formed by exerting external force to the wafer affixed to the adhesive tape whose adhesive strength has been reduced after the adhesive strength reducing step.

    摘要翻译： 一种分割具有形成在由前表面上形成为格子状的多个分割线划分的多个区域中的装置的晶片的分割方法，包括：劣化层形成步骤，用于形成 通过沿分割线施加具有晶片的磁导率的波长的激光束，沿着分割线在晶片内部的劣化层; 晶片支撑步骤，用于将晶片的后表面放置在安装在环形框架上并通过施加紫外线辐射而降低粘合强度的胶带的表面上; 粘合强度降低步骤，通过对已经粘贴所述晶片的粘合带施加紫外线辐射来降低所述粘合带的粘合强度; 以及分割步骤，用于通过对固定到粘合强度已经降低的粘合带上的晶片的外力施加外力，沿着分割线将晶片分割成各个器件。

    Wafer processing method
    10.
    发明申请
    Wafer processing method 有权
    晶圆加工方法

    公开(公告)号：US20050282359A1

    公开(公告)日：2005-12-22

    申请号：US11151526

    申请日：2005-06-14

    申请人： Yusuke Nagai ,  Satoshi Kobayashi ,  Masaru Nakamura

    发明人： Yusuke Nagai ,  Satoshi Kobayashi ,  Masaru Nakamura

    IPC分类号： B23K26/40 ,  B28D5/00 ,  H01L21/30 ,  H01L21/304 ,  H01L21/78

    CPC分类号： H01L21/304 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78 ,  H01L2221/6834

    摘要： A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.

    摘要翻译： 一种晶片处理方法，其特征在于，将沿着划分线将在前表面上形成的划分线的划分线的区域的功能元件分割为各个芯片，所述晶片处理方法包括在劣化层形成步骤中形成劣化层 通过施加能够从晶片的背面沿着划分线穿过晶片的激光束，从与晶片的前表面相对应的与芯片的最终厚度相对应的距离的位置的背面; 分割步骤，通过沿着分割线向已经形成有劣化层的晶片施加外力，沿着分割线将晶片分割成单个芯片; 以及后表面研磨步骤，用于将分成单个芯片的晶片的背面研磨至芯片的最终厚度。