发明申请
- 专利标题: Deposition system
- 专利标题(中): 沉积系统
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申请号: US11107819申请日: 2005-04-18
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公开(公告)号: US20060081188A1公开(公告)日: 2006-04-20
- 发明人: Hideki Komori , Masao Sumiyoshi , Toshio Tanaka , Miharu Kawashima
- 申请人: Hideki Komori , Masao Sumiyoshi , Toshio Tanaka , Miharu Kawashima
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-299622 20041014
- 主分类号: C23C16/00
- IPC分类号: C23C16/00
摘要:
A vacuum deposition system comprises a vacuum vessel, an evaporation source holder provided in the vacuum vessel for holding an evaporation substance and a holding jig provided in the vacuum vessel for holding a substrate facing the evaporation source. An adhesion-prevention member is provided at outer peripheries of the evaporation source and the holding jig along an inner wall of the vacuum vessel across a region from a position facing a lateral part of the evaporation source holder to a position facing a lateral part of the holding jig. The adhesion-prevention member is spaced apart from the inner wall of the vacuum vessel. The adhesion-prevention member includes members slanted diagonally downward from the central part side toward the inner wall. Thereby, the adhesion-prevention member prevents an evaporant from the evaporation source from adhering to the inner wall of the vacuum vessel.
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