发明申请
- 专利标题： Plating apparatus and plating method
- 专利标题（中）： 电镀装置及电镀方法
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申请号： US11251799申请日： 2005-10-18
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公开(公告)号： US20060081478A1公开(公告)日： 2006-04-20
- 发明人: Tsuyoshi Sahoda , Tsutomu Nakada , Nobutoshi Saito , Junichiro Yoshioka , Fumio Kuriyama , Masunobu Onozawa
- 申请人： Tsuyoshi Sahoda , Tsutomu Nakada , Nobutoshi Saito , Junichiro Yoshioka , Fumio Kuriyama , Masunobu Onozawa
- 优先权： JP2004-304852 20041019; JP2004-348248 20041201
- 主分类号： C25D5/20
- IPC分类号： C25D5/20 ; C25D17/00 ; C25B9/00
摘要：
A plating apparatus employs a dipping method with good gas-bubble releasability and, by regulating the flow of plating solution in a plating tank, can enhance the in-plane uniformity of a thickness of a plated film. The plating apparatus includes a plating tank for holding a plating solution, a plating solution jet nozzle having a slit-like plating solution jet orifice for jetting the plating solution toward a surface to be plated of an object to be plated disposed in the plating tank, and a plating solution supply section for supplying the plating solution to the plating solution jet nozzle.