发明申请
- 专利标题： Wafer packaging and singulation method
- 专利标题（中）： 晶圆包装和切片方法
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申请号： US11011640申请日： 2004-12-14
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公开(公告)号： US20060088981A1公开(公告)日： 2006-04-27
- 发明人: Chien-Hua Chen , Steven Geissler
- 申请人： Chien-Hua Chen , Steven Geissler
- 专利权人： Hewlett-Packard Development Company, LP
- 当前专利权人： Hewlett-Packard Development Company, LP
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/50
摘要：
A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.
公开/授权文献
- US07682934B2 Wafer packaging and singulation method 公开/授权日：2010-03-23
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