发明申请
- 专利标题: Strain-engineered ferroelectric thin films
- 专利标题(中): 应变工程铁电薄膜
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申请号: US10977335申请日: 2004-10-29
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公开(公告)号: US20060091434A1公开(公告)日: 2006-05-04
- 发明人: Chang-Beom Eom , Kyung-Jin Choi , Darrell Schlom , Long-Qing Chen
- 申请人: Chang-Beom Eom , Kyung-Jin Choi , Darrell Schlom , Long-Qing Chen
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A strained thin film structure includes a substrate layer formed of a crystalline scandate material having a top surface, and a strained layer of crystalline ferroelectric epitaxially grown with respect to the crystalline substrate layer so as to be in a strained state and at a thickness below which dislocations begin to occur in the crystalline ferroelectric layer. An intermediate layer may be grown between the top surface of the substrate layer and the ferroelectric layer wherein the intermediate layer carries the lattice structure of the underlying substrate layer. The properties of the ferroelectric film are greatly enhanced as compared to the bulk ferroelectric material, and such films are suitable for use in applications including ferroelectric memories.
公开/授权文献
- US07449738B2 Strain-engineered ferroelectric thin films 公开/授权日:2008-11-11
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