发明申请
- 专利标题： Current collimation for thin seed and direct plating
- 专利标题（中）： 目前准种子为薄种子和直接电镀
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申请号： US10988646申请日： 2004-11-15
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公开(公告)号： US20060102467A1公开(公告)日： 2006-05-18
- 发明人: Harald Herchen , John Dukovic , Lily Pang
- 申请人： Harald Herchen , John Dukovic , Lily Pang
- 主分类号： C25C3/16
- IPC分类号： C25C3/16 ; C25B9/00 ; C25D17/00
摘要：
A method and apparatus for plating a conductive material onto a substrate is provided. The apparatus includes a fluid processing cell having a fluid basin configured to contain an electrolyte solution and having an opening configured to receive a substrate for processing, an anode assembly positioned in the fluid basin, and a collimator positioned in the fluid basin between the anode assembly and the opening.
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