发明申请
- 专利标题: Method for data collection during manufacturing processes
- 专利标题(中): 制造过程中数据采集的方法
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申请号: US10988805申请日: 2004-11-15
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公开(公告)号: US20060106921A1公开(公告)日: 2006-05-18
- 发明人: Boon Sim , Ping Zhou
- 申请人: Boon Sim , Ping Zhou
- 专利权人: TECH Semiconductor Singapore Pte. Ltd.
- 当前专利权人: TECH Semiconductor Singapore Pte. Ltd.
- 主分类号: G06F15/177
- IPC分类号: G06F15/177 ; G06F15/173 ; G06F15/16
摘要:
The present invention discloses a new data collection method employed by a middle layer between the host and the equipment, which improves the speed and consistency of data collection. The middle layer incorporated with the proposed data collection method functions as a data format converter as well as a data processor/classifier, which helps to filter and format messages before delivering data to the host or equipment. The proposed data collection method enables the middle layer to perform local reply, local data sampling, and group data polling, thus relieving processing resources of both the equipment and the host. This allows implementation of APC on older wafer fabrication processes using old equipment.
公开/授权文献
- US07680556B2 Method for data collection during manufacturing processes 公开/授权日:2010-03-16
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