发明申请
- 专利标题: Wiring board manufacturing method
- 专利标题(中): 接线板制造方法
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申请号: US11266480申请日: 2005-11-04
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公开(公告)号: US20060112544A1公开(公告)日: 2006-06-01
- 发明人: Takashi Shuto , Kenji Takano , Kenji IIda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
- 申请人: Takashi Shuto , Kenji Takano , Kenji IIda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
- 申请人地址: JP kawasaki
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP kawasaki
- 主分类号: H05K3/20
- IPC分类号: H05K3/20 ; H01R43/00
摘要:
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
公开/授权文献
- US07377030B2 Wiring board manufacturing method 公开/授权日:2008-05-27