公开(公告)号：US20120229920A1

公开(公告)日：2012-09-13

申请号：US13356896

申请日：2012-01-24

申请人： Takuya OTSU ,  Kenichiro ABE ,  Yoshihiro UCHIDA

发明人： Takuya OTSU ,  Kenichiro ABE ,  Yoshihiro UCHIDA

IPC分类号： G02B9/60

CPC分类号： G02B13/0045 ,  G02B9/60 ,  G02B15/161

摘要： An imaging optical system smaller than conventional systems yet with well-corrected aberrations, comprises five lenses L1-L5 having refractive powers, in order from the object side: positive, negative, positive, positive, and, with an aperture at an endmost object-side position. In one embodiment, L1 is biconvex, L2's object-side surface is convex, L5's object-side surface is convex, and 1.0

摘要翻译： 成像光学系统比传统系统还小且具有良好校正的像差，包括从物体侧起依次具有折射光焦度的五个透镜L1-L5：正，负，正，正，以及最终物体的孔径， 侧位。 在一个实施例中，L1是双凸面，L2的物体侧表面是凸的，L5的物体侧表面是凸的，并且1.0

公开(公告)号：US07935891B2

公开(公告)日：2011-05-03

申请号：US12068992

申请日：2008-02-14

申请人： Takashi Shuto ,  Kenji Takano ,  Kenji Iida ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

发明人： Takashi Shuto ,  Kenji Takano ,  Kenji Iida ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

IPC分类号： H05K1/03

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/183 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/061 ,  H05K2203/085 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  H01L2224/0401

摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

摘要翻译： 本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体，以形成其中堆积层连接到芯基板的布线板。 通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

公开(公告)号：US20070295533A1

公开(公告)日：2007-12-27

申请号：US11806680

申请日：2007-06-01

申请人： Akiyoshi Saitou ,  Takeshi Midorikawa ,  Toru Kuraishi ,  Chikayuki Kumagai ,  Masashi Fujimoto ,  Kenichiro Abe

发明人： Akiyoshi Saitou ,  Takeshi Midorikawa ,  Toru Kuraishi ,  Chikayuki Kumagai ,  Masashi Fujimoto ,  Kenichiro Abe

IPC分类号： H05K1/09 ,  H01R43/00

CPC分类号： H05K1/0224 ,  H01L2924/0002 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/116 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4661 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/0959 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2203/0425 ,  H05K2203/063 ,  Y10T29/49117 ,  H01L2924/00

摘要： A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.

摘要翻译： 堆积板包括具有多层结构的堆积层和/或具有多层结构的芯层。 多层结构包括信号布线图案，连接到信号布线图案的焊盘，与焊盘相同的层上布置在焊盘周围的绝缘部分，以及布置在与焊盘相同的层上的绝缘部分周围的导体。 所述多层结构具有至少两个不同的保持部，其中所述挡板被定义为所述焊盘的轮廓与最靠近所述焊盘在同一层上的导体之间的最小间隔。

公开(公告)号：US06384371B1

公开(公告)日：2002-05-07

申请号：US09414546

申请日：1999-10-08

申请人： Ryo Hinei ,  Masaaki Uematu ,  Kuniyasu Matsumoto ,  Kenichiro Abe

发明人： Ryo Hinei ,  Masaaki Uematu ,  Kuniyasu Matsumoto ,  Kenichiro Abe

IPC分类号： B23K2608

CPC分类号： B23K26/10

摘要： A laser beam machining apparatus capable of highly accurate machining at a high speed. A parallel link mechanism including a plurality of links is fixed to a frame and a workpiece holder having moving means is provided thereunder. The links of the parallel link mechanism connect a movable member with a stationary member, and the movable member is moved with respect to the stationary member by the extending/retracting operation of the links. A laser head serving as a machining head is attached to the movable member. A supply line includes a laser transmitting optical fiber, pipes for supplying water, assist gas, etc., and an electrical signal line. A laser beam LB outputted from the laser head performs machining on a workpiece W on the workpiece holder. The supply line passes through a through hole formed inside link joint portions on the stationary member. Hollow motors for driving the links of the parallel link mechanism are mounted on the stationary member.

摘要翻译： 一种能够高精度高速加工的激光束加工装置。 包括多个连杆的平行连杆机构固定在框架上，并且在其下方设有具有移动装置的工件保持架。 并联连杆机构的连杆将可动部件与固定部件连接起来，通过连杆的伸缩动作，使可动部件相对于固定部件移动。 作为加工头的激光头安装在可动件上。 供电线包括激光发射光纤，供水管，辅助气体等，以及电信号线。 从激光头输出的激光束LB对工件W上的工件W进行加工。 供给线通过形成在固定部件上的连结接合部内的通孔。 用于驱动平行连杆机构的连杆的空心马达安装在固定件上。

公开(公告)号：US06222738B1

公开(公告)日：2001-04-24

申请号：US09040394

申请日：1998-03-18

申请人： Yoshinobu Maeno ,  Kenichiro Abe ,  Kouzi Soekawa

发明人： Yoshinobu Maeno ,  Kenichiro Abe ,  Kouzi Soekawa

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/78 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/06153 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K1/111 ,  H05K3/4602 ,  Y10T29/49146 ,  H01L2924/00

摘要： A packaging structure of semiconductor elements and for mounting such elements on which high density pads are formed on a board at a high production yield, where bumps or gold wires are bonded in a staggered manner within a pad on a semiconductor element. The spaces between bumps or gold wires can be widened without changing the semiconductor element.

摘要翻译： 一种半导体元件的封装结构，并且用于安装这样的元件，其上以高生产成本在板上形成高密度焊盘，其中凸块或金线以交错方式接合在半导体元件上的焊盘内。 可以在不改变半导体元件的情况下加宽凸块或金线之间的间隔。

公开(公告)号：US07846540B2

公开(公告)日：2010-12-07

申请号：US10562723

申请日：2004-08-03

申请人： Shigeru Sakai ,  Masayuki Kanemasu ,  Kenichiro Abe ,  Naoki Higuchi

发明人： Shigeru Sakai ,  Masayuki Kanemasu ,  Kenichiro Abe ,  Naoki Higuchi

IPC分类号： B32B27/04

CPC分类号： F16F7/124 ,  B32B5/06 ,  B32B5/26 ,  B32B5/28 ,  B32B7/08 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2605/003 ,  B32B2605/18 ,  Y10T428/249921 ,  Y10T428/249941 ,  Y10T428/31504 ,  Y10T442/2623

摘要： An impact-absorbing composite structure is formed with a resin and a fiber laminated body, and absorbs, when experiencing an impact, the impact by self destruction. An interlayer-strength improvement technique is applied on the impact-absorbing composite structure in an oblique manner or in a gradual manner.

摘要翻译： 用树脂和纤维层压体形成冲击吸收复合结构体，在经受冲击时，通过自身破坏而吸收冲击。 层压强度改善技术以倾斜的方式或以逐渐的方式应用于冲击吸收复合结构。

公开(公告)号：US20080142256A1

公开(公告)日：2008-06-19

申请号：US12068992

申请日：2008-02-14

申请人： Takashi Shuto ,  Kenji Takano ,  Kenji Iida ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

发明人： Takashi Shuto ,  Kenji Takano ,  Kenji Iida ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

IPC分类号： H05K3/02 ,  H05K1/11

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/183 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/061 ,  H05K2203/085 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  H01L2224/0401

摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

公开(公告)号：US20060108147A1

公开(公告)日：2006-05-25

申请号：US11320965

申请日：2005-12-30

申请人： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

发明人： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： G01R1/07314 ,  G01R1/44 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/117 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09845 ,  H05K2203/061

摘要： A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.

摘要翻译： 印刷电路板由彼此重叠的第一和第二基板制成。 第一和第二基板分别包括由含有碳纤维的树脂制成的芯层。 第二基板具有与第一基板的轮廓不同的轮廓。 至少在第一基板的表面上限定有台阶面。 电极可以形成在台阶表面以及第一基板的背面和第二基板的前表面上。 该结构能够检测来自台阶表面的电信号。 因此与具有简单地叠加的均匀基板的传统印刷线路板相比，可以在定位电极方面实现更大的灵活性。 这导致印刷电路板的使用或目的的扩大。

公开(公告)号：US5743145A

公开(公告)日：1998-04-28

申请号：US580429

申请日：1995-12-27

申请人： Akihiro Terada ,  Kenichiro Abe

发明人： Akihiro Terada ,  Kenichiro Abe

IPC分类号： F16H1/14 ,  F16H55/20

CPC分类号： F16H55/20 ,  Y10T74/19623 ,  Y10T74/19665 ,  Y10T74/19674 ,  Y10T74/19898

摘要： A gear mechanism in which the backlash between bevel gears can be easily adjusted is provided. The gear mechanism has first and second bevel gears which engage with each other; a supporting member, including first and second threaded portions, for the first and second bevel gears, and first and second bearings for rotatably supporting the first and second bevel gears on the supporting member. The first and second bearing include cylindrical members with threaded portions for engagement with the first and second threaded portions of the supporting member.

摘要翻译： 提供了可以容易地调节锥齿轮之间的间隙的齿轮机构。 齿轮机构具有彼此接合的第一和第二锥齿轮; 包括用于第一和第二锥齿轮的第一和第二螺纹部分的支撑构件以及用于在支撑构件上可旋转地支撑第一和第二锥齿轮的第一和第二轴承。 第一和第二轴承包括具有用于与支撑构件的第一和第二螺纹部分接合的螺纹部分的圆柱形构件。

公开(公告)号：US5080966A

公开(公告)日：1992-01-14

申请号：US639217

申请日：1991-01-09

申请人： Kenichiro Abe

发明人： Kenichiro Abe

IPC分类号： B32B18/00 ,  H01B1/02 ,  H01B1/06 ,  H01B1/08 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K1/092 ,  B32B18/00 ,  H01B1/026 ,  H01B1/08 ,  H01L21/486 ,  H01L23/49827 ,  C04B2237/32 ,  C04B2237/62 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/25

摘要： Vias each having no pore are formed in a multilayer ceramic substrate by filling through holes of green sheets with conducting material obtained by: kneading mixed powder particles, adding copper oxide powder particles 50% (in weight) or less to copper powder particles, with a solution including methyl ethyl ketone and 0.5% (in weight) of isosulfonyltridecylbenzene titanate; drying and cracking the kneaded mixed powder particles, producing cracked mixed powder particles; classifying the cracked mixed powder particles with a 100 mesh filter, producing classified mixed powder particles; spheroidizing the classified mixed powder particles with a collision method performed in gases flowing at high speed; and firing the green sheets at a temperature of about 800.degree. C.