公开(公告)号：US20060112544A1

公开(公告)日：2006-06-01

申请号：US11266480

申请日：2005-11-04

申请人： Takashi Shuto ,  Kenji Takano ,  Kenji IIda ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

发明人： Takashi Shuto ,  Kenji Takano ,  Kenji IIda ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

IPC分类号： H05K3/20 ,  H01R43/00

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/183 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/061 ,  H05K2203/085 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  H01L2224/0401

摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

摘要翻译： 本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体以形成其中堆积层连接到芯基板的布线板。 通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

公开(公告)号：US20120126393A1

公开(公告)日：2012-05-24

申请号：US13381507

申请日：2010-07-02

申请人： Kenji IIda

发明人： Kenji IIda

IPC分类号： H01L23/48 ,  C08K7/00 ,  C08L79/08 ,  B32B27/00

CPC分类号： H01L23/3737 ,  B32B27/08 ,  B32B27/281 ,  B32B2457/14 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/16 ,  C08K3/013 ,  C08K3/38 ,  C08K7/04 ,  C08K2201/016 ,  C08L2203/20 ,  H01L23/3735 ,  H01L2224/32225 ,  Y10T428/31721 ,  C08L79/08

摘要： Disclosed is a resin composition which has high heat dissipation properties and high electrical insulation properties at the same time, while having low-temperature bondability to a conductor circuit or the like. The resin composition contains (A) a thermoplastic polyimide resin having a glass transition temperature of 160 DEG C or less and (B) an inorganic filler. The aspect ratio, that is the value of length/thickness, of the inorganic filler (B) is 9 or more, and the content of the inorganic filler (B) is 40-70 weight % relative to the total weight of the resin composition. The resin composition has a melt viscoelasticity of 10-300 MPa (inclusive) at 170 DEG C.

摘要翻译： 公开了一种树脂组合物，同时对导体电路等具有低温可结合性，同时具有高散热性和高电绝缘性。 树脂组合物含有（A）玻璃化转变温度为160℃以下的热塑性聚酰亚胺树脂和（B）无机填料。 无机填料（B）的纵横比即长度/厚度值为9以上，无机填料（B）的含量相对于树脂组合物的总重量为40〜70重量％ 。 该树脂组合物在170℃下的熔体粘弹性为10-300MPa（含）。