发明申请
- 专利标题： Substrate package structure and packaging method thereof
- 专利标题（中）： 基板封装结构及其封装方法
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申请号： US11282836申请日： 2005-11-21
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公开(公告)号： US20060113668A1公开(公告)日： 2006-06-01
- 发明人: Katsumi Ishikawa , Hiroshi Takei , Nobuya Makino , Tetsuro Yano
- 申请人： Katsumi Ishikawa , Hiroshi Takei , Nobuya Makino , Tetsuro Yano
- 申请人地址： JP Kariya-city
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya-city
- 优先权： JP2004-342115 20041126
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.
公开/授权文献
- US07405478B2 Substrate package structure and packaging method thereof 公开/授权日：2008-07-29
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