公开(公告)号：US07405478B2

公开(公告)日：2008-07-29

申请号：US11282836

申请日：2005-11-21

申请人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

发明人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

IPC分类号： H01L23/42 ,  H01L23/52

CPC分类号： H01L24/11 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

摘要翻译： 衬底封装结构包括设置在第一衬底的表面侧上的凸块和第二衬底的表面侧。 第一基板上的凸块和第二基板上的凸起彼此压配合，同时第一基板的一个表面和第二基板的一个表面彼此面对，从而将第一和第二基板连接到 彼此。 第一基板上的凸起被构造成使得其顶端部分被设计成具有平坦表面，并且第二基板处的凸块被构造成使得末端部分被设计成具有比第一基板的尖端部分窄的突出部分 在第一衬底上碰撞。

公开(公告)号：US20060113668A1

公开(公告)日：2006-06-01

申请号：US11282836

申请日：2005-11-21

申请人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

发明人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

摘要翻译： 衬底封装结构包括设置在第一衬底的表面侧上的凸块和第二衬底的表面侧。 第一基板上的凸块和第二基板上的凸起彼此压配合，同时第一基板的一个表面和第二基板的一个表面彼此面对，从而将第一和第二基板连接到 彼此。 第一基板上的凸起被构造成使得其顶端部分被设计成具有平坦表面，并且第二基板处的凸块被构造成使得末端部分被设计成具有比第一基板的尖端部分窄的突出部分 在第一衬底上碰撞。

公开(公告)号：US20050205995A1

公开(公告)日：2005-09-22

申请号：US11063866

申请日：2005-02-24

申请人： Katsumi Ishikawa ,  Nobuya Makino ,  Hiroshi Takei

发明人： Katsumi Ishikawa ,  Nobuya Makino ,  Hiroshi Takei

IPC分类号： H01L21/60 ,  B23K31/00 ,  H01L23/48 ,  H01L31/0203 ,  H01R43/02

CPC分类号： B23K20/007 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49427 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2924/00012

摘要： A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.

摘要翻译： 用于接合多根导线以连接第一导体和第二导体的引线接合方法具有以下步骤。 1）将第一导电球接合在第一第一导体上。 2）将第一导线接合在第一导电球上，第一导线连接到第一导体。 3）将第二导电球接合在第二个第一导体上。 4）将第二导线接合在第二导电球上，第二导线连接到第二导体。 这里，第二第一导体或第二第二导体是接合在第一导电球上的第一导线。

公开(公告)号：US07285854B2

公开(公告)日：2007-10-23

申请号：US11063866

申请日：2005-02-24

申请人： Katsumi Ishikawa ,  Nobuya Makino ,  Hiroshi Takei

发明人： Katsumi Ishikawa ,  Nobuya Makino ,  Hiroshi Takei

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B23K20/007 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49427 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2924/00012

摘要： A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.

摘要翻译： 用于接合多根导线以连接第一导体和第二导体的引线接合方法具有以下步骤。 1）将第一导电球接合在第一第一导体上。 2）将第一导线接合在第一导电球上，第一导线连接到第一导体。 3）将第二导电球接合在第二个第一导体上。 4）将第二导线接合在第二导电球上，第二导线连接到第二导体。 这里，第二第一导体或第二第二导体是接合在第一导电球上的第一导线。

公开(公告)号：US20070023483A1

公开(公告)日：2007-02-01

申请号：US11484700

申请日：2006-07-12

申请人： Takao Yoneyama ,  Kimiharu Kayukawa ,  Nobuya Makino ,  Ryuichiro Abe

发明人： Takao Yoneyama ,  Kimiharu Kayukawa ,  Nobuya Makino ,  Ryuichiro Abe

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.

摘要翻译： 封装方法包括通过包括金作为其主要成分的凸块将半导体器件和衬底超声波接合在一起。 基板的一侧的铝焊盘表面上的主凸块的接触表面接触，并且超声波接合到半导体器件的一侧上的每个相对的次级凸块的远端表面。 接触表面的面积大于相对的远端表面的面积。 通过这种方法，可以减少来自超声波的基板的损伤，而不使用增强层。

公开(公告)号：US07470996B2

公开(公告)日：2008-12-30

申请号：US11484700

申请日：2006-07-12

申请人： Takao Yoneyama ,  Kimiharu Kayukawa ,  Nobuya Makino ,  Ryuichiro Abe

发明人： Takao Yoneyama ,  Kimiharu Kayukawa ,  Nobuya Makino ,  Ryuichiro Abe

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/00 ,  B23K1/06 ,  B23K5/20 ,  B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.

摘要翻译： 封装方法包括通过包括金作为其主要成分的凸块将半导体器件和衬底超声波接合在一起。 基板的一侧的铝焊盘表面上的主凸块的接触表面接触，并且超声波接合到半导体器件的一侧上的每个相对的次级凸块的远端表面。 接触表面的面积大于相对的远端表面的面积。 通过这种方法，可以减少来自超声波的基板的损伤，而不使用增强层。