公开(公告)号：US07405478B2

公开(公告)日：2008-07-29

申请号：US11282836

申请日：2005-11-21

申请人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

发明人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

IPC分类号： H01L23/42 ,  H01L23/52

CPC分类号： H01L24/11 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

摘要翻译： 衬底封装结构包括设置在第一衬底的表面侧上的凸块和第二衬底的表面侧。 第一基板上的凸块和第二基板上的凸起彼此压配合，同时第一基板的一个表面和第二基板的一个表面彼此面对，从而将第一和第二基板连接到 彼此。 第一基板上的凸起被构造成使得其顶端部分被设计成具有平坦表面，并且第二基板处的凸块被构造成使得末端部分被设计成具有比第一基板的尖端部分窄的突出部分 在第一衬底上碰撞。

公开(公告)号：US20060113668A1

公开(公告)日：2006-06-01

申请号：US11282836

申请日：2005-11-21

申请人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

发明人： Katsumi Ishikawa ,  Hiroshi Takei ,  Nobuya Makino ,  Tetsuro Yano

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

摘要翻译： 衬底封装结构包括设置在第一衬底的表面侧上的凸块和第二衬底的表面侧。 第一基板上的凸块和第二基板上的凸起彼此压配合，同时第一基板的一个表面和第二基板的一个表面彼此面对，从而将第一和第二基板连接到 彼此。 第一基板上的凸起被构造成使得其顶端部分被设计成具有平坦表面，并且第二基板处的凸块被构造成使得末端部分被设计成具有比第一基板的尖端部分窄的突出部分 在第一衬底上碰撞。

公开(公告)号：US07005313B2

公开(公告)日：2006-02-28

申请号：US10771461

申请日：2004-02-05

申请人： Minoru Murata ,  Toshiya Ikezawa ,  Tetsuro Yano

发明人： Minoru Murata ,  Toshiya Ikezawa ,  Tetsuro Yano

IPC分类号： H01L21/58

CPC分类号： G01P15/125 ,  G01P2015/0814 ,  Y10S414/141

摘要： A semiconductor dynamic sensor has a displacement portion, which is composed of a movable electrode and first and second fixed electrodes, formed in a semiconductor substrate. The movable electrode is displaced in response to applied acceleration, so that capacitance between the movable electrode and each of the first and second fixed electrodes changes. Therefore, the applied acceleration can be detected based on the capacitance change. A plurality of rectangular-shaped suction portions is provided at four corners on the surface of the semiconductor substrate. By sucking the suction portions using a collet check, the semiconductor dynamic sensor such can be transported without damaging the displacement portion.

摘要翻译： 半导体动态传感器具有形成在半导体衬底中的由可动电极和第一和第二固定电极组成的位移部分。 可移动电极响应于所施加的加速度而移位，使得可动电极与第一和第二固定电极中的每一个之间的电容发生变化。 因此，可以基于电容变化来检测所施加的加速度。 在半导体基板的表面的四个角设置有多个矩形的吸引部。 通过使用夹头检查吸引吸引部，可以输送半导体动态传感器而不损害位移部。