An electrical interconnect device attaches electrical devices with a cantilever spring with out the use of solder or adhesive. The cantilever spring latches to a contact structure such that there are a plurality of contact points between the spring and the contact structure. The cantilever spring has two tines at a tip end that define an opening in the spring. The contact structure is received by the opening between the two tines so that the spring and the contact structure mate. The spring may engage the contact structure by latching to the contact structure or by a post that urges the tip end of the spring against the contact structure.