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42 条记录 (耗时 0.026 秒)

    Latching structure and a method of making an electrical interconnect
    1.
    发明申请
    Latching structure and a method of making an electrical interconnect 有权
    闭锁结构和制造电气互连的方法

    公开(公告)号：US20060116010A1

    公开(公告)日：2006-06-01

    申请号：US10997931

    申请日：2004-11-29

    申请人： David Fork ,  Jurgen Daniel ,  Gordon Jagerson ,  Thomas Di Stefano

    发明人： David Fork ,  Jurgen Daniel ,  Gordon Jagerson ,  Thomas Di Stefano

    IPC分类号： H01R12/00

    CPC分类号： H01R4/4809

    摘要： An electrical interconnect device attaches electrical devices with a cantilever spring with out the use of solder or adhesive. The cantilever spring latches to a contact structure such that there are a plurality of contact points between the spring and the contact structure. The cantilever spring has two tines at a tip end that define an opening in the spring. The contact structure is received by the opening between the two tines so that the spring and the contact structure mate. The spring may engage the contact structure by latching to the contact structure or by a post that urges the tip end of the spring against the contact structure.

    摘要翻译： 电互连装置使用焊料或粘合剂将电气装置与悬臂弹簧连接。 悬臂弹簧锁定到接触结构，使得在弹簧和接触结构之间存在多个接触点。 悬臂弹簧在尖端具有两个尖端，在该弹簧中限定开口。 接触结构由两个齿之间的开口接收，使得弹簧和接触结构配合。 弹簧可以通过闩锁到接触结构或通过将弹簧的尖端抵靠接触结构的柱子卡合而接合接触结构。

    Digital impression printing system
    2.
    发明申请
    Digital impression printing system 有权
    数码印花系统

    公开(公告)号：US20070139477A1

    公开(公告)日：2007-06-21

    申请号：US11300793

    申请日：2005-12-15

    申请人： David Fork ,  Jurgen Daniel ,  Dirk Bruyker

    发明人： David Fork ,  Jurgen Daniel ,  Dirk Bruyker

    IPC分类号： B41J2/04

    CPC分类号： B41C1/00 ,  B41M1/00 ,  Y10S428/908

    摘要： A print structure includes a pattern layer that selectively actuates one or more of a plurality of actuators to selectively form one or more wells in a print surface to create a defined pattern on the print surface. A material is applied to the one or more wells and subsequently transferred to another surface in order to transfer the pattern.

    摘要翻译： 打印结构包括图案层，其选择性地致动多个致动器中的一个或多个致动器以选择性地在打印表面中形成一个或多个孔，以在打印表面上产生限定的图案。 将材料施加到一个或多个孔并随后转移到另一表面以便转移图案。

    Brittle fracture resistant spring
    5.
    发明申请
    Brittle fracture resistant spring 失效

    公开(公告)号：US20070178726A1

    公开(公告)日：2007-08-02

    申请号：US11347740

    申请日：2006-02-02

    申请人： David Fork ,  Thomas Hantschel

    发明人： David Fork ,  Thomas Hantschel

    IPC分类号： H01R12/00

    CPC分类号： H01R13/03 ,  H01R13/2407 ,  Y10T29/49204

    摘要： A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring material. A low modulus of elasticity cladding material may also be applied to the outer surface of the spring contact with a lower surface of the cladding material being formed with a compressive stress.

    Solar cell production using non-contact patterning and direct-write metallization
    6.
    发明申请
    Solar cell production using non-contact patterning and direct-write metallization 审中-公开
    使用非接触式图案化和直接写入金属化的太阳能电池生产

    公开(公告)号：US20070169806A1

    公开(公告)日：2007-07-26

    申请号：US11336714

    申请日：2006-01-20

    申请人： David Fork ,  Patrick Maeda ,  Ana Arias ,  Douglas Curry

    发明人： David Fork ,  Patrick Maeda ,  Ana Arias ,  Douglas Curry

    IPC分类号： H01L31/00

    CPC分类号： H01L31/1876 ,  H01L31/022425 ,  Y02E10/50 ,  Y02P70/521

    摘要： Photovoltaic devices (i.e., solar cells) are formed using non-contact patterning apparatus (e.g., a laser-based patterning systems) to define contact openings through a passivation layer, and direct-write metallization apparatus (e.g., an inkjet-type printing or extrusion-type deposition apparatus) to deposit metallization into the contact openings and over the passivation surface. The metallization includes two portions: a contact (e.g., silicide-producing) material is deposited into the contact openings, then a highly conductive metal is deposited on the contact material and between the contact holes. The device wafers are transported between the patterning and metallization apparatus in hard tooled registration using a conveyor mechanism. Optional sensors are utilized to align the patterning and metallization apparatus to the contact openings. An extrusion-type apparatus is used to form grid lines having a high aspect central metal line that is supported on each side by a transparent material.

    摘要翻译： 使用非接触式图案形成装置（例如，基于激光的图案形成系统）来形成光电装置（即，太阳能电池），以限定通过钝化层的接触开口，以及直接写入金属化装置（例如喷墨型印刷或 挤出型沉积设备）以将金属化沉积到接触开口中并在钝化表面上。 金属化包括两部分：将接触（例如，产生硅化物）的材料沉积到接触开口中，然后在接触材料上和接触孔之间沉积高导电性金属。 使用传送机构在硬模具配准中，在图案化和金属化装置之间输送装置晶片。 使用可选的传感器来将图案化和金属化装置对准接触开口。 使用挤出型装置形成具有高方位中心金属线的网格线，每条边由透明材料支撑。