发明申请
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
-
申请号: US10539926申请日: 2004-03-08
-
公开(公告)号: US20060118808A1公开(公告)日: 2006-06-08
- 发明人: Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
- 申请人: Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
- 申请人地址: JP OSAKA SHI, OSAKA 541-0041
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP OSAKA SHI, OSAKA 541-0041
- 优先权: JP2003-069711 20030314
- 国际申请: PCT/JP04/02982 WO 20040308
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.
公开/授权文献
- US07335925B2 Semiconductor device 公开/授权日:2008-02-26