发明申请
- 专利标题： Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
- 专利标题（中）： 在等离子体处理系统中减少副产物沉积的方法和装置
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申请号： US11022982申请日： 2004-12-22
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公开(公告)号： US20060130758A1公开(公告)日： 2006-06-22
- 发明人: Shrikant Lohokare , Andrew Bailey
- 申请人： Shrikant Lohokare , Andrew Bailey
- 主分类号： H05H1/24
- IPC分类号： H05H1/24 ; C23C16/00
摘要：
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
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