A method for cleaning electronic devices including the step of cleaning a target substrate placed in a cleaning chamber by etching using a cleaning solution which is circulated for reuse in a cleaning solution circulation path including at least the cleaning chamber and a cleaning solution circulation line, the method further including the steps of: (a) determining etch time based on data concerning variations in amount of a target film on the target substrate etched by the cleaning solution, the variations depending on time elapsed since the cleaning solution was fed into the cleaning solution circulation path; (b) etching the target substrate in the cleaning chamber using the cleaning solution for the determined etch time; and (c) rinsing the target substrate with water.