发明申请
- 专利标题： Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
- 专利标题（中）： 半导体制造装置及半导体装置的制造方法
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申请号： US11080944申请日： 2005-03-16
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公开(公告)号： US20060137988A1公开(公告)日： 2006-06-29
- 发明人: Katsunori Yahashi , Keiichi Takenaka , Masaki Narita , Itsuko Sakai
- 申请人： Katsunori Yahashi , Keiichi Takenaka , Masaki Narita , Itsuko Sakai
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 优先权： JPP2004-379446 20041228
- 主分类号： C25D21/12
- IPC分类号： C25D21/12
摘要：
According to an aspect of the present invention, a semiconductor manufacturing apparatus, including: a treatment chamber configured to house a substrate; an electrode which is disposed in said treatment chamber and on which the substrate is placed; a robot arm configured to convey the substrate to said electrode; and a sensor configured to detect a detection pattern of a focus ring which is disposed on an outer peripheral edge portion of said electrode, surrounds an peripheral edge of the substrate placed on said electrode and has the detection pattern, wherein clearance between the substrate and the focus ring is adjusted based on detection result of said sensor, is provided.
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