发明申请
- 专利标题: HEAT SINK FOR INTEGRATED CIRCUIT DEVICES
- 专利标题(中): 集成电路设备的散热
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申请号: US10905546申请日: 2005-01-10
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公开(公告)号: US20060152333A1公开(公告)日: 2006-07-13
- 发明人: Douglas Coolbaugh , Ebenezer Eshun , Terence Hook , Robert Rassel , Edmund Sprogis , Anthony Stamper , William Murphy
- 申请人: Douglas Coolbaugh , Ebenezer Eshun , Terence Hook , Robert Rassel , Edmund Sprogis , Anthony Stamper , William Murphy
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01C1/08
- IPC分类号: H01C1/08
摘要:
A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.
公开/授权文献
- US07310036B2 Heat sink for integrated circuit devices 公开/授权日:2007-12-18