发明申请
- 专利标题: Electrolytic process using anion permeable barrier
- 专利标题(中): 电解过程使用阴离子渗透屏障
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申请号: US11299293申请日: 2005-12-08
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公开(公告)号: US20060157355A1公开(公告)日: 2006-07-20
- 发明人: Rajesh Baskaran , Robert Batz , Bioh Kim , Tom Ritzdorf , John Klocke , Kyle Hanson
- 申请人: Rajesh Baskaran , Robert Batz , Bioh Kim , Tom Ritzdorf , John Klocke , Kyle Hanson
- 申请人地址: US MT Kalispell
- 专利权人: Semitool, Inc.
- 当前专利权人: Semitool, Inc.
- 当前专利权人地址: US MT Kalispell
- 主分类号: B23H5/00
- IPC分类号: B23H5/00
摘要:
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
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