A method for manufacturing microchip antenna comprises a dielectric substrate having antennal radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths; a dielectric substrate having the antennal radiated conductor paths being packaged by the material capable of adjusting easily dielectric constant; and an antennal object including antennal radiated conductor paths, feeding ends, welding spots and packaging materials. The main body of the antenna has multi-folded paths, feeding ends, welding spots, and a packaging body. The radiation wires of the antenna is built on a single or a multiple input ends on a dielectric substrate and is multi-folded wires and it is packaged by another dielectric material. The radiation wires of the antenna can be designed and manufactured in three dimension so as to reduce the area occupied by the antenna and reduce the coupling interference between the elements.