公开(公告)号：US20180055413A1

公开(公告)日：2018-03-01

申请号：US15677168

申请日：2017-08-15

申请人： Chia-Hung Chen

发明人： Chia-Hung Chen ,  Hsiao-Pao Yen ,  Chia-Chi Su ,  Liang-Lin Yen

IPC分类号： A61B5/087

CPC分类号： A61B5/087 ,  A61B5/097 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/5223

摘要： Spirometer, mouthpiece tube and inspection method thereof. The spirometer includes at least the mouthpiece tube and an ultrasound detector configured to detect the ultrasound generated by the gas flowing through the mouthpiece tube, wherein the mouthpiece tube has a shell having an opened end, a closed or opened end, and an ultrasonic generator configured to be inserted into different portions of the shell in different situations. Therefore, by inserting the ultrasonic generator into different portions of the shell during expiration and inspiration, the gas flow during expiration and inspiration may be transformed into the ultrasonic signal and then maybe detected and analyzed.

公开(公告)号：US20130190912A1

公开(公告)日：2013-07-25

申请号：US13354548

申请日：2012-01-20

申请人： Wen-Yuh JYWE ,  Tung-Hsien Hsieh ,  Chia-Hung Chen ,  Chin - Hui Huang ,  Ying-Chien Tsai ,  Yen-Chieh Wang

发明人： Wen-Yuh JYWE ,  Tung-Hsien Hsieh ,  Chia-Hung Chen ,  Chin - Hui Huang ,  Ying-Chien Tsai ,  Yen-Chieh Wang

IPC分类号： G05B19/4097

CPC分类号： G05B19/4097 ,  G05B2219/49084

摘要： A method of numerical-control scraping of a work piece has a preparing step, a scanning step, a flatness-parameter inputting step, a surface-finishing step, a related-parameter inputting step, an auto-scraping step and an analyzing step. The preparing step comprises preparing a multi-axis machine tool, a laser displacement meter, an auto scraping apparatus and a computer. The scanning step comprises scanning the work piece. The flatness-parameter inputting step comprises inputting a flatness-parameter. The surface-finishing step comprises calculating out the to-be-scraped ranges of the work piece and scraping the work piece. The related-parameter inputting step comprises inputting desired PPI and POP in the computer, calculating out the HOP, the DOS and the oil content to obtain the length, the width and the depth of a single scraping process. The auto-scraping step comprises scraping the work piece to meet the requirement. The analyzing step comprises detecting the 3D-appearance drawing of the work piece.

摘要翻译： 一种数控刮削工件的方法具有准备步骤，扫描步骤，平坦度参数输入步骤，表面精加工步骤，相关参数输入步骤，自动刮除步骤和分析步骤。 制备步骤包括制备多轴机床，激光位移计，自动刮除装置和计算机。 扫描步骤包括扫描工件。 平坦度参数输入步骤包括输入平坦度参数。 表面精加工步骤包括计算工件的被刮削范围并刮擦工件。 相关参数输入步骤包括在计算机中输入所需的PPI和POP，计算出HOP，DOS和油含量，以获得单次刮除过程的长度，宽度和深度。 自动刮削步骤包括刮擦工件以满足要求。 分析步骤包括检测工件的3D外观图。

公开(公告)号：US20080246397A1

公开(公告)日：2008-10-09

申请号：US11696220

申请日：2007-04-04

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01J99/00 ,  H01J9/26

CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.

摘要翻译： 白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色 光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成 一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。 当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光， 共同推动输出功率显着提升，亮度明显增强。

公开(公告)号：US07229290B1

公开(公告)日：2007-06-12

申请号：US11532537

申请日：2006-09-17

申请人： Lung-Chiao Chang ,  Shun-Fa Yu ,  Kuan-Hsun Lu ,  Chia-Hung Chen

发明人： Lung-Chiao Chang ,  Shun-Fa Yu ,  Kuan-Hsun Lu ,  Chia-Hung Chen

IPC分类号： H01R12/00

CPC分类号： H01R12/721 ,  H01R13/6594

摘要： An interface card includes a circuit board including an opening, a connector installed on an edge of the circuit board, a covering means including a first shield installed on a side of the circuit board and including a hole, and a second shield installed on the other side of the circuit board including a pin for passing through the opening of the circuit board and inserting into the hole of the first shield so as to combine the second shield with the first shield for covering the connector.

摘要翻译： 接口卡包括电路板，其包括开口，安装在电路板的边缘上的连接器，覆盖装置，其包括安装在电路板的一侧上并包括孔的第一屏蔽和安装在另一个上的第二屏蔽 电路板的一侧包括用于穿过电路板的开口并插入第一屏蔽件的孔中的销，以将第二屏蔽与第一屏蔽组合以覆盖连接器。

公开(公告)号：US6005021A

公开(公告)日：1999-12-21

申请号：US196976

申请日：1998-11-20

申请人： Chia-hung Chen ,  Thomas E. Dando

发明人： Chia-hung Chen ,  Thomas E. Dando

IPC分类号： B22C1/22 ,  C08G18/66

CPC分类号： B22C1/2273 ,  C08G18/6674

摘要： This invention relates to polyurethane-forming foundry binder systems and foundry mixes which comprise a foundry aggregate, said foundry binder system, and a liquid amine curing catalyst. The binder system comprises a polyol component containing a polyether polyol and a monomeric glycol, and an organic polyisocyanate component. The foundry mixes are used to prepare foundry shapes made from foundry mixes by a no-bake process.

摘要翻译： 本发明涉及聚氨酯成型铸造粘合剂体系和铸造混合物，铸造混合物包括铸造骨料，所述铸造粘合剂体系和液体胺固化催化剂。 粘合剂体系包含含有聚醚多元醇和单体二醇的多元醇组分和有机多异氰酸酯组分。 铸造混合物用于通过无烘焙工艺制备由铸造混合物制成的铸造形状。

公开(公告)号：US09244458B2

公开(公告)日：2016-01-26

申请号：US13354548

申请日：2012-01-20

申请人： Wen-Yuh Jywe ,  Tung-Hsien Hsieh ,  Chia-Hung Chen ,  Chin-Hui Huang ,  Ying-Chien Tsai ,  Yen-Chieh Wang

发明人： Wen-Yuh Jywe ,  Tung-Hsien Hsieh ,  Chia-Hung Chen ,  Chin-Hui Huang ,  Ying-Chien Tsai ,  Yen-Chieh Wang

IPC分类号： G05B19/4097

CPC分类号： G05B19/4097 ,  G05B2219/49084

摘要： A method of numerical-control scraping of a work piece has a preparing step, a scanning step, a flatness-parameter inputting step, a surface-finishing step, a related-parameter inputting step, an auto-scraping step and an analyzing step. The preparing step comprises preparing a multi-axis machine tool, a laser displacement meter, an auto scraping apparatus and a computer. The scanning step comprises scanning the work piece. The flatness-parameter inputting step comprises inputting a flatness-parameter. The surface-finishing step comprises calculating out the to-be-scraped ranges of the work piece and scraping the work piece. The related-parameter inputting step comprises inputting desired PPI and POP in the computer, calculating out the HOP, the DOS and the oil content to obtain the length, the width and the depth of a single scraping process. The auto-scraping step comprises scraping the work piece to meet the requirement. The analyzing step comprises detecting the 3D-appearance drawing of the work piece.

摘要翻译： 一种数控刮削工件的方法具有准备步骤，扫描步骤，平坦度参数输入步骤，表面精加工步骤，相关参数输入步骤，自动刮除步骤和分析步骤。 制备步骤包括制备多轴机床，激光位移计，自动刮除装置和计算机。 扫描步骤包括扫描工件。 平坦度参数输入步骤包括输入平坦度参数。 表面精加工步骤包括计算工件的被刮削范围并刮擦工件。 相关参数输入步骤包括在计算机中输入所需的PPI和POP，计算出HOP，DOS和油含量，以获得单次刮除过程的长度，宽度和深度。 自动刮削步骤包括刮擦工件以满足要求。 分析步骤包括检测工件的3D外观图。

公开(公告)号：US08648042B2

公开(公告)日：2014-02-11

申请号：US13483382

申请日：2012-05-30

申请人： Chau-Hui Wang ,  Chia-Hung Chen ,  Jing-Yi Chen ,  Chih-Wei Hsu

发明人： Chau-Hui Wang ,  Chia-Hung Chen ,  Jing-Yi Chen ,  Chih-Wei Hsu

IPC分类号： A61K8/00 ,  A61K38/39 ,  C07K7/06 ,  C07K7/08 ,  C07K14/78 ,  A61K47/48 ,  A61K8/65 ,  A61L27/24

CPC分类号： A61K31/661 ,  A61K47/61 ,  A61K47/645 ,  A61K2300/00

摘要： A pharmaceutical polymer and a method for quenching free radicals is described. The pharmaceutical polymer comprises a glycopeptide covalently bound to an aminothiol moiety. The pharmaceutical polymer and method can be applied before or after the occurrence of radiation exposure.

摘要翻译： 描述了药物聚合物和猝灭自由基的方法。 药物聚合物包含与氨基硫醇部分共价结合的糖肽。 药物聚合物和方法可以在辐射暴露发生之前或之后施用。

公开(公告)号：US20130005661A1

公开(公告)日：2013-01-03

申请号：US13483382

申请日：2012-05-30

申请人： Chau-Hui Wang ,  Chia-Hung Chen ,  Jing-Yi Chen ,  Chih-Wei Hsu

发明人： Chau-Hui Wang ,  Chia-Hung Chen ,  Jing-Yi Chen ,  Chih-Wei Hsu

IPC分类号： A61K38/02 ,  A61K38/16 ,  A61P39/06 ,  C07K2/00 ,  C07K14/00

CPC分类号： A61K31/661 ,  A61K47/61 ,  A61K47/645 ,  A61K2300/00

摘要： The present invention discloses a pharmaceutical polymer and a method for quenching free radicals. Said pharmaceutical polymer comprises a glycopeptides and an aminothiol moiety which covalently bonds together. The disclosed pharmaceutical polymer and method can be applied before or after the occurrence of radiation exposure.

摘要翻译： 本发明公开了一种药物聚合物和猝灭自由基的方法。 所述药物聚合物包含共价键合在一起的糖肽和氨基硫醇部分。 所公开的药物聚合物和方法可以在辐射暴露发生之前或之后施用。

公开(公告)号：US20110179022A1

公开(公告)日：2011-07-21

申请号：US12938386

申请日：2010-11-03

申请人： Chia-Hung Chen

发明人： Chia-Hung Chen

IPC分类号： G06F17/30

CPC分类号： G06F16/40

摘要： A method of analyzing claims of a patent includes retrieving a patent document. The patent document includes at least one claim. The method further includes analyzing the claim and a vocabulary database so as to generate at least one conjunction term of the claim with an analysis device, and evaluating quality of the claim according to the at least one conjunction term with the analysis device.

摘要翻译： 分析专利权利要求的方法包括检索专利文献。 该专利文件包括至少一个权利要求。 该方法还包括分析权利要求和词汇数据库，以便利用分析装置生成权利要求的至少一个连接词，并根据与分析装置的至少一个连词来评估权利要求的质量。

公开(公告)号：US07741648B2

公开(公告)日：2010-06-22

申请号：US11976340

申请日：2007-10-24

申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC分类号： H01L29/18

CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

摘要： An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

摘要翻译： LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。 陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。 导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。 中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。 包装胶体填充在用于覆盖LED芯片的接收空间中。