发明申请
US20060187719A1 Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof
审中-公开
半导体封装，ID生成系统，ID识别系统，ID识别方法，半导体集成电路芯片，其ID生成系统，ID识别系统及其ID识别方法
- 专利标题： Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof
- 专利标题（中）： 半导体封装，ID生成系统，ID识别系统，ID识别方法，半导体集成电路芯片，其ID生成系统，ID识别系统及其ID识别方法
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申请号： US11240553申请日： 2005-10-03
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公开(公告)号： US20060187719A1公开(公告)日： 2006-08-24
- 发明人: Michikazu Matsumoto , Yasutoshi Okuno , Kazuyoshi Tsukamoto , Toshiki Yabu
- 申请人： Michikazu Matsumoto , Yasutoshi Okuno , Kazuyoshi Tsukamoto , Toshiki Yabu
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 优先权： JP2005-001864 20050106
- 主分类号： G11C7/10
- IPC分类号： G11C7/10
摘要：
In ID generation for a semiconductor package or a semiconductor integrated circuit chip, a topographic characteristic to be utilized as specific information is selected from at least one topographic characteristic that the semiconductor package or the semiconductor integrated circuit has. Then, the selected topographic characteristic is measured as the specific information and an ID for identification is generated for the semiconductor package or the semiconductor integrated circuit chip based on the measured specific information.