- 专利标题: Semiconductor device and method of manufacturing the same
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申请号: US11117337申请日: 2005-04-29
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公开(公告)号: US20060189070A1公开(公告)日: 2006-08-24
- 发明人: Masaru Kidoh , Hideaki Aochi , Ryota Katsumata , Masaru Kito , Hitomi Yasutake
- 申请人: Masaru Kidoh , Hideaki Aochi , Ryota Katsumata , Masaru Kito , Hitomi Yasutake
- 优先权: JP2005-044125 20050221
- 主分类号: H01L21/8242
- IPC分类号: H01L21/8242
摘要:
A semiconductor device includes a semiconductor substrate, a trench formed in the semiconductor substrate, an island-like element region formed in the semiconductor substrate, having an upper surface, first to third side surfaces, an upper portion, a middle portion and a lower portion, a gate insulating film formed on the first to third side surfaces in the upper portion of the element region, a gate electrode having first and second bottom surfaces, a first diffusion layer formed along the upper surface of the element region, a second diffusion layer formed along the first side surface in the middle portion of the element region, a channel region having first to third regions formed along the first to third side surfaces in the upper portion of the element region, a capacitor formed in the trench, and a bit line electrically connected to the first diffusion layer.
公开/授权文献
- US07145197B2 Semiconductor device and method of manufacturing the same 公开/授权日:2006-12-05
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